第一篇：PCB英文ICS總結重新整理修訂

英文ICS總結

1． Thickness，Line（1）沒有明確指出銅厚

Question description：The copper for all layer is not indicated, we can‘t make sure how to build.GF Suggestion：We will use 1oz copper thickness for inner layer, for outer layer, we will use H oz as base copper thickness and plate to 1oz finished copper thickness.Question description The copper thickness is not indicated.GF Suggestion： We will use 1OZ copper foil on inner layers, and use H oz as base copper then plated to 1 oz.Please kindly confirm!

（2）1OZ建議為完成銅厚

Question description：In Gerber file copper thickness request 1OZ,but we can‘t make sure this copper thickness is finished copper thickness.GF Suggestion：We will 1OZ copper finished thickness, Please confirm kindly.（3）建議1.6MM做完成板厚

Question description: You request board thickness 1.60mm, we can＇t make sure if it is finished board thickness and bare board thickness。

GF Suggestion：1.We will control the finished board thickness as 1.6+/-10%mm 2.We will control the finished board thickness(including plating copper thickness and solder mask thickness)as 1.60+/-0.16mm。

Question description：We don‘t know the 1.6MM is finished board thickness or laminate board thickness.GF Suggestion：1.Regard 1.6MM as the finished board thickness(including the plating copper thickness, solder mask and silkscreen thickness).2.Regard 1.6MM as the laminate board thickness(no including the plating copper thickness, solder mask and silkscreen thickness).（4）1OZ建議做到1.70OZ Question description：You required 2OZ finished copper thickness as but it is。

GF Suggestion：Please relax the finished copper thickness to 1.7/1.7oz(min)，difficult for us to plate the copper from 1/1oz to 2/2oz。

（5）PTL的厚度和資料中要求的板厚不同

Question description：The board thickness that you supplied 0.059inch in PO is unmatched that in drawing file ―sheet 1 of 1‖ 0.063inch.GF Suggestion：We will control the finished board thickness as 1.6+/-10%mm。（6）無完成板厚要求

Question description：No call finished board thickness.GF Suggestion： Finished board thickness 1.6+/-10% mm.（6）調整層壓板厚結構

Question description：Customer has asked to change the final board thickness from 47mil to 62mil, and the impedance is also required in the lay-up details, in order to control the 6mil line with impedance as 62+/-10%ohms.We would have to adjust the lay-up structure slightly as shown.(See the fig02.jpg)GF Suggestion: Please confirm.。

（7）內層底銅不確定

Question description：The copper thickness on inner layers was not indicated.GF Suggestion：2 OZ copper clad on inner layers.Please confirm!

（8）錫厚8—12um，建議最小1um Question description： On drill drawing, it defined the Tin-Lead thickness as 8-12um，it is too difficult to control during mass production.GF Suggestion： We suggest control the Tin-Lead thickness as 1um(min).（9）厚度不明確

Question description：We don‘t know the 1.57mm is laminate thickness or total board thickness(including the plated thickness, solder mask and silkscreen thickness).GF Suggestion：We will regard the 1.57mm as total board thickness(including the plated thickness, solder mask and silkscreen thickness), please kindly confirm!

（10）鍍金厚度

Question description： Customer required, ―SHALL BE AU PLATED, 5UIN.MIN.”，it is over our technical ability(4uin.Max.)GF Suggestion：We will follow our technical ability to control the Au plated, 2uin.min, please kindly confirm!（11）控制錫厚度

Question description：HASL thickness 5~15um is difficult to control for us.GF Suggestion：Pls.relax it to 1um(min.)（14）錫厚控制

Question description：Tin thickness is required as 0.3mil,but this is too thick and has extended out of our capability.GF Suggestion：Control the solder thickness as 0.04mil min.（15）外層銅厚度

Question description：Customer required that copper outer was 0.5oz finished, but it‘s difficult for us to build as 0.5oz finished copper for outer layers.GF Suggestion： We would like to use 0.5oz base copper plated to 35um(min)for outer layers.（16）層壓厚度調整

Question description：Customer required that ―core layer spacing GND-PWR was 0.8mm(min), and prepreg layer spacing TOP-GND, PWR-BOT was 0.3mm(min)‖, but in order to reduce the cost。

GF Suggestion：We would like to adjust the core layer spacing GND-PWR to 0.63mm and prepreg layer spacing TOP-GND, PWR-BOT to 0.38mm.（17）錫厚

Question description： Customer required that ―ALL COPPER PADS AND PLATED THROUGH HOLES SHALL BE SOLDER DIPPED AND HOT AIR LEVELED WITH 63/37 TIN LEAD TO A THICKNESS OF.001 TO.0014 INCHES.‖ in NO.8 But the thickness of tin-lead on copper pads was too thick for us to control.GF Suggestion： We would like to control the thickness of tin-lead as 0.0001 inches(min)on holes wall and 0.00004 inches(min)on copper pads.(18)沉金厚度

Question description： Customer required that immersion gold thickness was 1u‖ to 3u‖, but it‘s too tight for us to control.GF Suggestion： Please relax it to 1u‖ to 6u‖.（19）鍍金厚度

Question description：Customer required, ―SHALL BE AU PLATED, 5UIN.MIN.”，it is over our technical ability(4uin.Max.)GF Suggestion：We will follow our technical ability to control the Au plated, 2uin.min, please kindly confirm!（20）V-CUT余厚太厚，不好分板

Question description: In Gerber file ,you request V-CUT residual thickness 0.025+/-0.004,it is difficult for you to separate the board，see fig below.GF Suggestion：We will control the V-CUT angle as 30+/-5 degree, and the remaining thickness 0.020+/-0.004‖, please confirm kindly（21）板厚公差超出我們能力

Question description: the finished board thickness tolerance ‖+/-0.003inch‖ is out of our capability.(See fig01.jpg)GF Suggestion: Please relax to +/-0.006inch.（22）板厚度公差太大

Question description: The finished board thickness tolerance 62mil+/-5mil is too tight for us to control GF Suggestion：Relax the board thickness tolerance to 62+/-7mil.（23）線路與PAD之間沒有連接上 斷線頭

Question description：There are snap circuit in the board, we can‘t make sure if it is normal design.See fig below.GF Suggestion： We will think it is normal design and follow Gerber to build.（24）銅皮的邊緣有銳齒

Question description：The are some saw tooth copper，we can‘t make sure if it is normal design.See fig2.pdf

GF Suggestion：

1、We will follow Gerber file to build，Please kindly confirm!

2、We will shave the saw tooth copper to keep the copper smooth

（25）間隙太小，建議填實

Question description：There are some gap in the big copper, we can‘t make sure if we need to infill these gap.GF Suggestion：We will infill these gap with copper, please confirm kindly.Question description：The clearance between the copper grids on topside is only 0.001‖(see fig04);it cannot be etched out during our process.GF Suggestion： We suggest filling them as wholly copper.（26）隔離環形狀的改變

Question description：See fig below, some slot is unmatched with its thermal pad in inner layer.GF Suggestion： We will coordinate the thermal pad according to the slot shape, please confirm kindly.（27）開短路

Question description：See fig below, there are 0.00013mm gap between the circuit and pad, we can‘t make sure if it be short or open.GF Suggestion：

1、If it should be open, we will move the circuit away the pads to avoid the short happened.2、If it should be short, we will fill the gap between the circuit and the pad with copper, please confirm kindly.（28）線路離邊太近。刮銅，移動線路，同時進行

Question description：The copper is close to the board edge that will lead to copper exposed after milling and beveling.(See fig03)GF Suggestion： Shave copper or move conductor and avoid copper to be exposed.（29）斷線處理

Question description：There are snap circuit in the board, we can‘t make sure if it is normal design.See fig below.GF Suggestion： We will think it is normal design and follow Gerber to build.（30）移線

Question description：On top side, there are one trace which is overlap the outline, when profile outline, it will damage this trace see fig below GF Suggestion：We suggest shifting this trace into the board so as to keep enough spacing between the outline and the trace.2.Hole（1）沒有定義孔的屬性

Question description：No define the attribute of all holes and four DIA 125mil is located at tab isolate position.GF Suggestion：Make these four holes to NPTH and others PTH。Question description：The hole attribute is undefined(PTH or NPTH)。

GF Suggestion：So we will build these holes without pad as NPTH, the rest are PTH, please confirm kindly.（2）孔大于PAD，兩面均為獨立的，資料定義為PTH Question description：Two Dia.100mil hole is as big as its pad, and they are isolated on both sides, but you defined it as PTH.See fig below.GF Suggestion：

1、We will build this hole as NPTH.2、We will build this as PTH without ring.（3）孔與PAD等大，兩面均為獨立的，資料定義為PTH Question description：You defined two DIA。100mil as PTH holes, but these two holes have as large as its PAD，and isolated on both sides, see fig below.GF Suggestion：A、Build these two holes as PTH holes without ring。B、Build these two holes as NPTH holes, please confirm kindly.（4）孔離邊太近，建議客戶接受破孔

Question description：In Gerber file Two φ50mil的NPTH holes are closed to board edge, See fig below, after fabrication.Them will cause these two holes to be broken.GF Suggestion:

1、Follow the Gerber file to build, and broken holes is allowed.2、We will move these holes inside the board, avoid these holes broken holes.Question description：Some slot is so closed to the board edge that it will slot broken.GF Suggestion：We will follow Gerber to build, it is allowed slot broken.（5）孔或PAD距V-CUT太近，建議接受破孔,露銅

Question description：Some holes and pads are so closed to the V-cut centre that copper will be exposed and these holes maybe broken, see fig below.GF Suggestion： We will follow Gerber to build, copper exposed and hole broken is allowed.Question description： In Gerber file, the finger is too closed to the board edge, after routing, copper will be exposed at the slot edge.See fig below.GF Suggestion： We will follow Gerber to build, Copper exposed is allowed.Question description：See the figure below, some circuit is so closed to the outline(just 0.12mm)that it will cause circuit damaged after v-cut.GF Suggestion： We will move these circuits inside the board to avoid circuit to be V-cut.（6）不確定某些層的孔圈是否需要做出

Question description：We can‘t make sure if we need to build these holes that you marked in layer ―board outline‖

GF Suggestion：We will build these holes as NPTH, please confirm kindly.（7）NPTH孔鉆于大銅面上或PAD上

Question description：Some NPTH holes are drilled on big copper, see fig below.GF Suggestion：We will shave copper or pad to get 10mil clearance around the NPTH to avoid copper exposed at the hole edge.（8）NPTH孔距離內層線路太近

Question description：Some NPTH is so closed to the circuit(just 4mil)in inner layer that it will cause circuit damaged.GF Suggestion：We will move these circuits away from the NPTH to avoid circuit damaged.（9）建議過孔綠油入孔但不塞孔制作

Question description:In Gerber file, all ofφ0.3mm holes have no solder mask openings on both sides.GF Suggestion: Allow solder mask into holes but don‘t plug them.Question description：No S/M opening for DIA.0.3mm holes.GF Suggestion：We will build these holes as solder mask in holes but not plug them, please confirm kindly.Question description：No S/M opening for some DIA.0.25mm, 0.30mm holes.GF Suggestion：We will plug these VIAS with solder mask, please confirm kindly.（10）部分孔徑較大，塞孔超出我司能力

Question description：If question 1 you accept suggestion, No S/M opening for Dia.0.60mm holes on both sides, but these hole too big to plug, It is out of our capability to fabricate.GF Suggestion：We will build these holes as solder mask in holes but not plug them, please confirm kindly.（11）資料中的孔數為44個，但孔表中只有42個，而文件中有孔位

Question description：The quantity of DIA： 28mil is 44 in drill symbol table, but the quantity of DIA： 28mil is 42 in drill tape(see figure 1,these two positions have no hole, only have drill symbol), them is conflicting.GF Suggestion：Following to drill symbol table(the quantity of DIA: 28mil is 44)to drill these two hole.（12）文件中的孔數與孔表中的孔不相符

Question description：You mention that there are 286 DIAS 32mil holes in drill drawing(see fig below), but we only found 283 DIAS.32mil holes in drill tape.GF Suggestion：We will follow the drill tape to build, please confirm kindly.Question description：In drill tape, the hole size corresponding to the symbol ―U‖ is dia30.1mil, but the hole chart define the ―U‖ hole size as 20x50mil, at the same time, the drawing require the ―U‖ hole size as 30x50mil, see fig01.GF Suggestion：1.Build the ―U‖ holes size as 24x50mil.2.Build the ―U‖ holes size as 30x50mil.Question description：Some thermal pad size is smaller than hole size on inner layers, see fig02.GF Suggestion： Delete these thermal pads, which are smaller than hole size.（13）由孔改變成SLOT Question description：Some DIA.3.94mil holes should be changed to slot, but we can't make sure the attribute of these slot.GF Suggestion：We will build the size 2mmX4mm slot as NPTH, and build the size 1.5X3.25mm slot as PTH, also the holes centre is the slot centre, please confirm kindly.See fig below.（14）無焊盤的孔

Question description：Slots of 3.3*5.0 mm are stated as PTH slots, but two slots have no pads on both sides，see picture below.GF Suggestion:

1.Build these two slots, as PTH slots but have no ring on both sides.2.Build them as NPTH slots.Question description：There were 4X φ3.50mm holes defined as PTH holes in the file ―MCUV.drl‖, but them located on copper on one side without copper pad on the other side, see fig below.GF Suggestion：

1、We will build the fourφ3.50mm holes located on copper on one side as PTH and other as NPTH, and build the four holes without annular ring on no pad side.2、We will build all of the φ3.50mm holes as NPTH, and shave copper for 10mil to get enough spacing for tenting holes in our process.（15）板中無工具孔，建議增加三個工具孔在板上

Question description：No suitable tooling hole for routing and E-test process on board.GF Suggestion：In order to help to fabricate, we suggest to add three 2.0mm NPTH on board, approximately location shown as fig04

Question description：There are no NPTH holes for tooling holes in this board，it will bring us some difficulties in routing and E-test process.GF Suggestion： So we will add three DIA。3.0mm NPTH for tooling holes, please confirm kindly.（16）使用PTH孔做工具孔，允許孔壁擦花

Question description：There are not proper NPTH holes as tooling hole in the board, If above is confirm, We need 3X Dia.2.0mm~5.0mm holes to build as guided holes for E-TEST and routing process, but we have only 2X NPTH holes, So we will use 1X Dia.125mil PTH hole as guided holes and the slightly scrape for the PTH hole is accepted, see picture below.GF Suggestion：Please kindly confirm.（17）孔間距太近，建議客戶做SLOT槽

Question description：In Gerber file six φ37mil PTH holes ,they are so close with each, we can‘t make sure if we need to build them as a slot.See fig1.GF Suggestion: We will build them as slot, the slot size is 0.94mmX2.59mm, please confirm kindly（18）板中沒有工具孔，而PTH孔都太小，增加三個工具孔將削銅10MIL Question description： No tooling holes for this board(There are no NPTH holes exist in this board, and all PTH hole are too small).We will add three holes for tooling according to attached file 4008221A0 pdf.But these holes are drilled on bigger copper in out layer and inner layer，we will shave copper to get 10 mil clearance around it for avoiding copper exposed.GF Suggestion ： Please confirm kindly.（19）孔大于PAD，允許崩盤

Question description：In Gerber file ,part φ47mil holes art defined as PTH holes, but have 3 holes on both sides PADS is smaller than its pads ,see fig below.GF Suggestion：We will follow Gerber to build, broken pad is allowed.（20）孔間隙太小，建議縮小孔徑

Question description：We found the distance between two stamp holes is so close(only 0.13mm), it may cause holes broken after drilled.GF Suggestion：We will reduce the size of the stamp holes from 0.508mm to 0.40mm and avoid hole broken.（21）管位孔，孔壁允許輕微摩擦

Question description: Due to no non-plated hole in board, we will choose three plats hole in board to assist manufacturing and slight scrape in holes maybe occur.GF Suggestion：Please kindly confirm it is acceptable.（22）非沉銅孔，周圍有PAD，二鉆,允許孔邊露銅

Question description: There are four DIA 142mil and one DIA 125mil holes drilled on the copper pad of the top or bottom side circuit layer.(See fig04.jpg)GF Suggestion： Second drill the NPTH hole and the copper pad around the hole exposed is acceptable.Please confirm.（23）無孔的屬性

Question description：No call the holes type(PTH or NPTH)(see fig01)GF Suggestion： Holes 0.11‖(12x)are NPTH, others are PTH, please kindly confirm!（24）過電孔無開窗，按綠油入孔但不塞孔制作

Question description：All the VIA holes(DIA 0.4mm and 0.5mm)have no solder mask openings on the both sides.We would build them, as Solder Mask can be into holes but not plug them.GF Suggestion： Please confirm.（25）孔上PAD，同時孔上線路，孔不合理，刪除孔

Question description：The holes(DIA.30mil, GF Suggestion：We suggest remove all these holes(dia.30mil, count: 96)which all drilled on SMT PAD on TOP side, and on BOTTOM side partly of these holes drilled on traces(see fig01), we think this design is abnormal.After our incoming checking, we regard these holes(dia.30mil, count: 96)are redundant.GF Suggestion：1.We suggest removes all these holes(dia.30mil, count: 96).2.Otherwise please customer to resend drill data to us so that we can precede this board efficiently.（26）孔與PAD等大，刪除PAD，做NPTH Question description： On current drill data, some holes(dia.118mil, 4x: dia.135mil, 4x;dia.135mil, 16x;dia.138mil, 12x)are required as PTH on file Loop Card-P.DRR(see fig02)，but on GERBER file their pads size are equal to the finished hole and their pad are isolated on both sides.GF Suggestion： We suggest drill these above mentioned holes as Non-plated holes(SEE FIG03).（27）無重孔，客戶胡說八道

Question description： On file Loop Card-P.DRR(see fig02), it state:‖ Two holes at same point: 40 ‖，but in fact ,we didn‘t find any two hole at same point.GF Suggestion：We suggest ignore this statement.（28）NPTH在大銅面上，刮銅離邊10mil Question description：There are 3 holes(NPTH, DIA.30mil)per unit, which drilled on big copper on topsides, and have pad with size dia.79mil on bottom side(see fig04).GF Suggestion： We will shave copper to get 10mil clearance away from hole edge on both sides.（29）孔鉆到了線路上，二鉆這兩個孔，允許露銅

Question description: there are two DIA 3.0mm NPTH holes drilled over the circuit pad partly on both sides.(See fig02.jpg)GF Suggestion： Second drill the two-NPTH hole and the copper pad around the hole wall exposed is acceptable.Please confirm!（30）孔一面開了等大的窗，一面無開窗

Question description： In artwork five DIA 130 mil holes have no solder mask opening on topside and the solder mask opening is the same size with drill hole on bottom side.Please see fig 1 question 3.GF Suggestion： 1.We will enlarge or add the solder mask opening to match the pads both sides.2.Cover pads on both side and to avoid ink into holes we will leave a little annular ring around the hole.3.Cover pads on top side and to avoid ink into holes we will leave a little annular ring around the hole, increase the solder mask opening to match the pads on bottom side.4.Please give other advice.（31）孔，單面無開窗。1.加阻焊窗。2.蓋焊環有錫圈

Question description： In artwork sixteen DIA 41 mil holes have no solder mask opening on topside。

GF Suggestion：1.Cover pads on topside and to avoid ink into holes we will leave a little annular ring around the hole.2.Add solder mask opening on topside to match the square pads.3.Please give other advice.（32）無孔的屬性。全部按PTH做

Question description： In artwork there is no information for hole attribute.GF Suggestion： We will make all holes as plated thru holes Please confirm.（33）PTH孔，無PAD。1,做NPTH。2,做無PAD的PTH Question description： It stated in drill drawing that the DIA 3.0mm holes are plated holes but have no pads in Gerber.Please see fig 1 question 1 GF Suggestion：1.Make these two holes as non-plated holes.2.Make them as plated holes without annular ring both sides.（34）無孔的屬性，其中有一個孔沒有PAD，做NPTH Question description： There is no information for the holes attribute in artwork and the DIA 3.5mm holes have no pads for the original design please see fig 1 question 3.GF Suggestion： 1.Make them as non-plated holes.2.Make them as plated holes without annular ring both sides.3.Please give other advice.（35）PTH孔做管位孔，允許孔壁輕微擦花

Question description： There are no NPTH holes as tooling holes for the routing and E-test process.GF Suggestion： We suggest to use PTH hole as the tooling holes, and then these holes wall will be slightly scrap and copper exposed allowable.（36）過電孔雙面未開窗，按綠油入孔但不塞孔制作

Question description： No solder mask opening for DIA.0.7mm via hole on both sides

GF Suggestion： Follow CAD to build, the solder mask fall into hole but not plug.（37）孔太大，不宜鉆，建議銑并放寬公差

Question description：The 6.3mm NPT hole is too big to drill.GF Suggestion：Fabricate the hole by routing and relax its tolerance to +/-0.13mm.（38）孔和PAD偏位

Question description：Pad and via hole shown in picture below is deviated from the desired location.GF Suggestion： 1：Adjust the location of pad according to its solder mask opening, and move via hole to center of pad.2：Follow Gerber to build but enlarge the solder mask opening.（39）疊孔處理

Question description：Hole legend of dia.28mil and dia.40mil is at the same position, see picture below, and there are 561 of dia.28mil holes, but the quantity of dia.28mil holes in tape is 560.GF Suggestion：Follow drill tape to build.（40）沒有孔做工具孔，允許使用PTH孔，允許檫花

Question description： There are no NPTH holes to be used as guiding holes for E-Test and routing.GF Suggestion：Use PTH hole as guiding hole, and scratching hole wall a little is acceptable.（41）孔銅厚度更改

Question description：Copper thickness on hole wall is required as 1.5mil,this is too thick for us to plat.GF Suggestion：We will control the minimum hole wall thickness as 1mil.（42）沒有PAD的孔

Question description：No pad for four DIA.118mil holes, and one pad of DIA.67mil holes are smaller than its hole.But you defined these holes as PTH.GF Suggestion：

1、We will build them as PTH without ring.2、We will build these holes as NPTH，please confirm kindly.（43）孔公差

Question description: Like fig below, you defined this PTH holes tolerance as +3mil/-0, it is difficult for us to meet you requirement.GF Suggestion：

1、Please relax these holes tolerance to +/-3mil, please confirm kindly.2、Please relax these holes tolerance to +5/-1mil, please confirm kindly.Question description: You required us tolerance of the hole size as +/-0.1mm in the file of ―P840 read me.txt ―, but it is unmatched with ‖hole size tolerance as +0.1mm/-0mm ‖ in the file ―spec.gbr‖ and the tolerance as +0.1mm/-0mm is too tight for us to control.GF Suggestion: We will ignores this difference and to control the tolerance of the hole size as +/-0.10mm, please kindly confirm.（44）沒有PAD的PTH孔

Question description：All holes had been defined as PTH hole, but some holes(1Xφ4.1mm and 4Xφ6mm and 1Xφ10mm)had no copper PAD and located at base material.GF Suggestion：1.We will build these holes as NPTH holes.2.We will build these holes as PTH holes without annular ring on both sides.（45）大小孔疊孔

Question description：The two holes were located at the same position, one is φ6mm and the other is φ10mm, see picture below.GF Suggestion：1.We will delete dia.6mm hole and to be build dia.10mm hole.2.We will delete dia.10mm hole and to be build dia.6mm hole.（46）孔太大,改變公差被ROUT出

Question description：Because the φ10mm holes was too big for us to drill out, and we would like to rout it out, please accept the tolerance as +/-0.1mm.GF Suggestion：Please kindly confirm.（47）過油孔

Question description：All of the dia.0.4mm holes had no S/M opening on both sides, and 6Xdia.0.8mm holes had no S/M opening on one side, We will build these holes as solder mask can flow into holes but not plug them for no solder mask opening side.GF Suggestion：Please kindly confirm.（48）沒有定義孔的屬性

Question description：The holes attribute was undefined, checking the original Gerber: 6*dia.188mil & 4*dia.100mil & 2*dia.125mil and 8x slots was drilled on base material, we would like to build this holes and slot as non-plated one;others we would like to build them as plated holes.GF Suggestion： Please kindly confirm.（49）孔的尺寸和樣板不一致

Question description：We have found the hole sizes in sample board mismatch with which are indicated in GERBER data.Please see the discrepancy in fig3.GF Suggestion：1.Please provide the finished hole sizes for us.2.The finished size of non-plated hole is Φ1.15mm.Regard the two plated holes we pointed out in fig3 as Φ1.10mm holes.The others follow GEREBR.（50）增加工具孔和對位光點和DUMMY PAD Question description：From feedback of other company‘s engineer question, require adding tooling hole, but we cannot find the corresponding tooling holes in drawing and customer require add fiducially mark, but in file ―CS-paste‖ & ―SS-paste‖, we find only add fiducially mark opening(φ2.00mm)on both sides, but have no the size of fiducially mark.detail place(Detail panel drawing see 4054099a0.pdf,add tooling holesφ2.0mm(3x)and fiducially markφ1.0mm(3x)solder masker openingφ2.0mm).GF Suggestion: We will according to file ―CS-paste‖ & ―SS-paste‖ and customer‘s require, design panel drawing(include the size of fiducially mark and opening and tooling holes)(detail panel drawing see 4054099A0.pdf), please confirm!We would like to add dummy pad at breakaway tab on both sides in order to improving process.（51）孔的公差太緊，建議放松公差

Question description： The DIA.166mil holes tolerance +3/-0mil is too tight for us to control(see fig below)

GF Suggestion： Please relax the tolerance to +4/-2mil.Question description：Such as Q1.jpg pointed, the hole true position tolerance +/-0.03mm is too tight to produce.GF Suggestion：Please allow relaxing the tolerance from +/-0.03mm to +/-0.076mm.Question description：Customer required the finished board thickness 1.6+/-0.1mm,see fig01;this tolerance is too tight to control in our produce.GF Suggestion：Please relax the tolerance +/-0.10mm to +/-0.15mm.Question description：Customer required the tolerance of NPTH size: +/-0.025mm;PTH size: +/-0.05mm are out of our capability，see fig01, we cannot control them.GF Suggestion：Please relax the tolerance: NPTH size:+/-0.025mm to +/-0.05mm and PTH size:+/-0.05mm to +/-0.075mm.Question description：It required ―tolerance: +/-0.05mm‖ in the drawing, but the tolerance is too tight for us to control.GF Suggestion： We will control PTH tolerance is +/-0.076mm,NPTH tolerance is +/-0.05mm, slot hole tolerance is +/-0.1mm, profile dimension tolerance is +/-0.15mm.(52)過電孔top面綠油入孔但不塞孔，bottom面按原稿,開窗制作

Question description： In artwork of original design the 19.7mil holes have no solder mask opening only on topside.GF Suggestion： For this 19.7 mil via holes on topside we will only cover the pads and allow ink flowing into holes, on bottom side we will follow original design.(53)孔尺寸不對 Question description: See the figure below, the size and count of some NPTH hoes in the ―Spec.gbr‖ is unmatched with hole chart in ―dwg1.gbr‖

GF Suggestion: We will ignores these differences and follows the Gerber to build as the hole chart in ―dwg1.gbr‖

（54）孔公差

Question description：Undefined the tolerance of the holes.GF Suggestion：+ /-0.076mm for PTH holes and + /-0.05mm for NPTH holes.（55）孔到邊公差

Question description：There was no dimension tolerance of hole to edge.GF Suggestion：In order to smooth our process, we would like to control it as +/-0.13mm.（56）公制孔徑與英制孔徑，選用英制孔徑

Question description： The Metric hole size in the drill drawing are mismatched with English hole size in drill file.GF Suggestion： We suggest following the Metric hole size in the drill drawing to build.（57）孔圖是公制，鉆帶說明文件是英制，不匹配

Question description： Mismatched holes size between the hole drawing(Metric)and file‖TP1-05.rep‖(English)

GF Suggestion ： Follow hole size in Metric in hole drawing。

3.Opening.Pad（1）光點開窗過大，導致保護銅環露銅

Question description：The S/M opening of the fiducially marks is so big that protective ring is exposed, we can‘t make sure if it will effect your assembly.GF Suggestion：

1、We will follow Gerber to build, protective ring exposed is allowed.2、We will reduce the S/M opening to avoid protective ring exposed.（2）光學點開窗太大，導致附近的線路露銅

Question description：In Gerber file the S/M opening of this fiducially mark is so big that the circuit nearby is exposed.(See fig below)GF Suggestion： We will shave the S/M opening in order to avoiding the circuit exposed.（3）SMT的綠油開窗太小

Question description：In the Gerber file some solder mask opening is smaller than SMD PAD, GF Suggestion： We will follow Gerber to build, and allow solder mask to be covered on the SMD.（4）NPTH孔綠油開窗大，建議削銅制作

Question description：In Gerber file, four DIA φ3.50MM holes drilled on the big copper pads on the Top and bottom side circuit layer.But you defined them as NPTH.See fig below。GF Suggestion ：

1、We will build these holes as PTH, please confirm kindly.2、We will build these holes as NPTH, we will shave copper to get 10mil clearance away from hole edge on both sides with easy to process.Question description：We found some DIA.4.00mm holes are drilled on copper in inner layer.GF Suggestion： We will shave copper to get 10mil clearance around the DIA.4.00mm holes, please confirm kindly.（5）部分PAD位沒有開窗，不確定是否為正常設計

Question description：See fig below, no S/M opening for some pads, we can‘t make sure if it is your normal design.GF Suggestion：We will follow Gerber to build, please confirm kindly.（6）文件中有些多余開窗

Question description: See the figure below, we found some extra S/M opening;it may cause some circuit or copper exposed.GF Suggestion: We will delete these extra S/M opening, please kindly confirm.（7）綠油開窗太大，線路導致露銅

Question description：In Gerber file the S/M opening of is so big that the circuit nearby is exposed.(See fig below)

GF Suggestion： We will shave the S/M opening in order to avoiding the circuit exposed.（8）板中有些“+”符號沒有開窗

Question description：―+‖ Symbol have no solder masker opening in top layer.(See fig below)

GF Suggestion：We will follow Gerber file to build.（9）綠油邊窗

Question description：The solder mask opening of the board edge is so big that we can‘t make sure if we need to delete it.GF Suggestion：

1、We will delete the solder mask opening of the board edge, please confirm kindly.2、We will follow Gerber to build.（10）對位光點開窗過大

Question description：It was so big for the S/M opening of fiducially marks and the protected ring was exposed.GF Suggestion：Decrease the S/M opening to avoid exposing protected ring.（11）內層非功能PAD刪除，為了降低報廢率

Question description：There are non-functional isolated pads in inner layer If them have been removed then it will be helpful for improving quality and production.GF Suggestion：So please kindly permit us to remove these non-functional pads in inner layers.（12）加DUMMY PAD Question description：We would like to add dummy pad at breakaway tab in order to improving process on both sides.GF Suggestion：Please kindly confirm.Question description：There is no dummy pad on tab in panel Gerber.GF Suggestion：Add dummy pads on tab to optimize the distribution of electric current.（13）PAD離外形太近。1.刮銅。2.允許露銅

Question description： Copper pads are too close to profile please see fig 2 question 6.GF Suggestion： 1.Shave pads a little to keep 10 mil gap away from profile Avoid copper exposing at board edge after fabrication.2.Follow Gerber design and allow copper exposing at board edge.（14）除獨立（非功能）PAD Question description：There are non-functional isolated pads in inner layer If them have been removed then it will be helpful for improving quality and production.GF Suggestion：Please kindly confirm.（15）Pad離板邊太近

Question description：Some pad is so closed to the board edge that copper will be exposed after fabrication GF Suggestion：

1、We will shave the pad 0.25mm away from the board edge to avoid copper exposed.2、We will follow Gerber to build, copper exposed at the board edge is allowed.（16）板邊PAD露銅

Question description: Some pad is extending the outline, see fig below, after routed, the copper pad would be exposed at the slot edge, and the pad maybe breaks out.GF Suggestion：

1、Follow artwork and the copper pad exposed at the slot edge and these pad broken-out is acceptable.2、We will shave the copper to get 10mil clearance away from the slot edge to avoid copper exposed at the slot edge，but please allow these pads will be broken out.（17）PAD離NPTH孔太近

Question description: See the figure below, we found some pad is so clear round the NPTH.GF Suggestion: We will shave the pad and to get 0.25mm away from the NPTH to ensure enough free room for dry film tenting.（18）光點增加DUMMY PAD Question description： In order to avoid the fiducially marks to be peeled off in our process, we would like to add dummy pad on the breakaway.GF Suggestion： Please kindly confirm.（19）SHAVE PAD 不露銅

Question description： We will shave copper around break-off hole to avoid copper be exposed.GF Suggestion： Pls.kindly confirmed.（20）方PAD設計的圓形綠油窗

Question description: In Gerber file, the pad on the circuit layer is square ,but the solder mask is round ,we don‘t know if it is normal design，the solder mask maybe cover the pad.GF Suggestion：1.We will think it is normal design, and follow Gerber file to build.2.We will coordinate the S/M opening shape to square and avoid solder mask covering the pad.（21）客戶要求6MIL的焊環，我們很難做到，建議做2MIL Question description： Customer required ―annular ring to be 0.006 inch minimum‖, it is tight for us to control.GF Suggestion：We will control 2mil annular ring in finished product.Question description: You required us ―minimum copper in the hole is 0.0015‖, but it is very difficult for us to build.GF Suggestion: We will build this board as the minimum copper in the hole is 0.001‖, please kindly confirm.（22）RING 太大

Question description: Note 3: it stated ―????ALL HOLES SURROUNDED BY LAND SHALL HYAVE A MINIMUM ANNULAR RING OF.005‖ ‖, but it is difficult for us to control the minimum annular ring of 5mil.GF Suggestion：We will control the annular ring 2mil(min.)in finished product, please confirm kindly.4.Component Mark（1）將板中的MADE IN USA 改為MADE IN CHINA Question description： See fig below, there are etching text ―MADE IN USA‖ in the board, we can‘t make sure if we need to delete or change it to ―MADE IN CHINA‖.GF Suggestion： We have changed it to ―MADE IN CHINA‖ in working Gerber, please confirm kindly.Question description: We found some legends as ―made in USA‖ on the top side of silkscreen, in order to avoid causing trouble during custom inspection, we need change it into ―made in china‖ or delete.GF Suggestion :

1、We will delete ―MADE IN U.S.A‖, Please confirm kindly.2、We will change it to ―MADE IN CHINA‖, please confirm kindly.3、We will peel able S/M material covering in ―MADE IN U.S.A‖, Please confirm kindly.（2）板中的某些字符需鏡像

Question description： The text ―1‖ is abnormal in top and bottom side that viewed from topside.(See fig below)GF Suggestion：We will mirror this text please kindly confirm.（3）在GERBER文件的板邊有一些文字

Question description：In Gerber file, there is text‖ANT-0585/41-00160‖ in tab area of all layer(see figure 2)

GF Suggestion： 1.Follow Gerber file to build.2.Delete these texts of all layers.（4）字符在工藝邊上，我們不確定是否需要保留

Question description：Some legend is located on break tab, we can‘t make sure if we need to remain it, see fig blow GF Suggestion：We will leave it, as it is, follow Gerber to build.（5）有些字符上大錫面，而無處可移的

Question description：Some legend are located on big response pads, See fig below, we can‘t make sure how to build。

GF Suggestion： We will follow Gerber to build, please confirm kindly.Question description： Like fig below, some legend are located on component pads.GF Suggestion： We will follow Gerber to build, allow legend to be covered on these pads, please confirm kindly.Question description：Some legend are located on the big component pad, see fig below.GF Suggestion ：

1、We will shave legend to avoid legend located on pads.2、We will enlarge legend to avoid legend located on pads.（6）SMT間的白油橋做不出，需建議刪除

Question description：There are character bridges between the Pads on the board.There is only 10mil distance between the SMD Pads.It is out of our capability to fabricate the character bridge.(We need 16mil distance to fabricate the character bridge out.)GF Suggestion： We will delete these character bridges between the Pads.Please confirm.（7）字符上PAD，而可以移動的

Question description：Some legends are located on the big component pad, see fig below.（Silkscreen letter lie on copper with solder mask opening）GF Suggestion ： 1.We will Move these letter to avoid these letter lie on copper with solder mask opening.Please confirm kindly.2、Follow Gerber file to build.（8）字符設計在線路上，開窗露銅

Question description：Some S/M opening legend is located on circuit, these circuit will be exposed, we don‘t know if it is normal design, see Fig2 in file ―fig.Pdf‖.GF Suggestion：Move the S/M opening legend to avoid circuit to be exposed.（9）客戶說有兩面字符，但資料只有一面字符

Question description：You tell us that ―SCREEN MARKING ON TOP SIDE OF BOARD.USE TWO-PAR WHITE EPOXY INK‖, there are only top silkscreen layer in the Gerber, we don‘t quite know the meaning ―USE TWO-PART WHITE EPOXY INK.‖

GF Suggestion：

We will ignore the information ―USE TWO-PART WHITE EPOXY INK‖, and only to print the top silkscreen in white epoxy ink, please confirm kindly.（10）客戶的資料中有字符層但說明文件不需印字符

Question description：You required that no need to print legend on this board in the specification, but there are component legend in Gerber.We have print white legend on the board according to the Gerber data in the first sample board.GF Suggestion: We will follow the sample board, print legend on the board, please confirm kindly.（11）不能確定客戶是否需要加DATE CODE Question description：We can‘t make sure the date code pattern that your required, WWYY(week-year)or YYWW(year-week)

GF Suggestion：

1、We will add the date code as WWYY, please confirm kindly.2、We will add the date code as YYWW, please confirm kindly.（12）建議增加ULLOGO及DATE CODE在板上

Question description： We will add our UL logo & date code(wwyy)and Made In China by component side silkscreen.See fig below.GF Suggestion：Please confirm kindly.（13）客戶需要增加一些文字，但沒有指定地方

Question description：Customer require to add ―Made In China‖ in PCB board, but don‘t show use which mode to add

GF Suggestion：We will add ―Made In China‖ in top silkscreen, position see figure 1

（14）客戶只提到加DATE沒有提到是否加ULLOGO Question description：You only required us to add the date code on , we don‘t know if we need to add our UL logo on the board.GF Suggestion:

1、Only add date code on the board，no need to add UL logo。

2、We will add our UL logo and date code on the board as usual，please confirm kindly。

Question description：We didn‘t find other vendor‘s UL logo on the board in scan0001.JPG.GF Suggestion：We will add our UL logo and date code(YYWW)in negative solder mask on bottom side.（15）建議增加ULLOGO及DATE CODE在工藝邊

Question description：There is no enough place to add our UL-logo and Date-code(WW-YY)on the unit.We will add them only on the breakaway“topmask.dpf”layer。(The position as arrow pointed).GF Suggestion： Please kindly confirm!（16）信息不明白

Question description：We don‘t know these words meanings as fig below.GF Suggestion：1.Ignore this information, please confirm kindly.2.Please translate this information for us in English or Chinese.Question description：This is a 2-layers board, but there were two files ―42f14ba.GP1‖ and ―42f14ba.GP2‖ which were the same, and we don‘t know whether they are inner layers or not.GF Suggestion：1.Build this board as 2-layers and ignore these two files.2.We will build this board as 4-layers board, and build these two layer as inner layer, and all the inner layer is the same, please confirm kindly.3.Please give us your advice in detail.（17）字符上PAD Question description：Some legend are located on the big component pad, see fig below.GF Suggestion ：We will move the legend like fig below, please confirm kindly.（18）板邊的文字很難辨認

Question description：From scan0001.JPG, we can found that there are some texts on the tab, but they are illegible, please see new-fig1.GF Suggestion：1.Ignore them.2.If they are the texts we should add on the tab, please tell us the detail.（19）板中文字很難辨認

Question description：In Gerber file, we found that there are some texts in ‖ silktop.gbr‖ on the board, but they are illegible.See fig below.GF Suggestion：We will ignore them Follow Gerber file to build.（20）板中的文字有重疊

Question description：Some legend are superpose, see fig below.GF Suggestion ：We will Move these letter as fig below, please confirm kindly.（21）板中的文字有超出板外

Question description：Some legend are out of the board，See fig below, we can‘t make sure how to build。GF Suggestion： We will move these legends into the board, see fig below, please confirm kindly.Question description：Some legend is out of the board, see fig below.GF Suggestion：We will delete these legend out of the board, please confirm kindly.（22）兩面字符是相同的

Question description: The legend on both side is the same, we can‘t make sure if it is normal design.GF Suggestion： We will think it is normal design, and follow Gerber to build, please confirm kindly.（23）字符在板邊，V-CUT會被傷到，建議移到另一邊

Question description: to avoid the letter be damaged by v-score, we would like to move these letters to the right side of the board, see fig GF Suggestion： Please kindly confirm.（24）字符層數的澄清

Question description： In the file ―PCB_PROTECTL-000A-FAB.pdf‖ note 7, it states that the board only needs to print the component side silkscreen layer.But in the Gerber data, there exists two silkscreen layers.(See fig01.jpg)GF Suggestion：1.follow the Gerber design and the board needs to print the silkscreen on the both sides.2.ignore the solder side silkscreen layer in the Gerber data and the board just needs to print silkscreen on the component side.（25）字符入孔

Question description: In artwork file, there is text that is located in NPTH hole in top silkscreen(see figure 1).GF Suggestion：1.We will delete these texts.2.We will move these texts to suitable position.Question description：Some legend laid on pad and fell into holes.GF Suggestion：We would like to remove the legend on the pad.（26）白油字與銅字重疊

Question description: In artwork file, text in top silkscreen and copper text is partly overlapping(see figure 2).GF Suggestion：We will move silkscreen text to suitable position to ensure that silkscreen text isn‘t overlap with copper text.（27）字符上SS面焊環

Question description：Some characters in the solder side silkscreen layer are overlapped the solder pad, we do not know if it is normal design.(See fig02.jpg)GF Suggestion: 1.noarmal design and follow cad to do, the silkscreen characters over the solder pads is acceptable.2.delete the silkscreen characters, which overlapped with the solder pad.（28）加我司UL、logo、Date code GF Suggestion： We will add our company UL logo and date code 8888(yyww)by component side silkscreen.Please confirm!（29）字符雙面與單面的小糾紛 Question description： It noted the solder side silkscreen as white(see fig02), but in GERBER file only the topside silkscreen existing.GF Suggestion： We suggest following the GERBER file to precede the topside silkscreen color as white only and no solder side silkscreen.（30）加我司UL logo & date code于CS面

Question description： We will add our UL logo & date code on silkscreen layer, approximately location shown as fig01 GF Suggestion： Please kindly confirm！

（31）存在客戶logo Question description：Other vender‘s logo has existed on tab.GF Suggestion：We will replace the existed logo on tab with our UL Logo and date code(see attached picture).（32）蝕刻字反字

Question description：The etching layer number in layer 1 is opposite from layer 1 viewed, we can‘t make sure if we need to mirror these etching numbers, see fig below.GF Suggestion：

1、We will follow Gerber to build，please confirm kindly、2.We will mirror the etching layer number, please confirm kindly.（33）文字過不了CIQ Question description：There are text ―Proudly MADE in the USA by MURPHY SWITH OF CA‖ in the legend layer, if we follow Gerber to build, there are some law question when passing the CIQ, see fig below.GF Suggestion：We will cover these legends with peel able mask when delivery, but you need remove these peel able mask after you received

（34）字符移動或者刪除

Question description：Component mark lies on solder area at some places, see picture below.GF Suggestion：Move characters away from solder area, and delete the silkscreen lines on solder area.（35）沒有字符層

Question description: You said not required silkscreen and it have no silkscreen layer in the Gerber too, but at the same time, the ―P840 EXTENTS.GBR‖ list including‖ CSCP.GBR: COMP SIDE IDENT‖ and we are not found this file, we are not sure if this board need silkscreen or not, see the figure for detail.GF Suggestion: We will ignore this difference and follow the Gerber to build this board without silkscreen, please kindly confirm.。

（36）沒有地方增加LOGO Question description：This board is so small that there is no space to add UL logo and date code.GF Suggestion：We will add our UL logo and date code(YYWW)on the rail.（37）客戶的PO要求蝕刻ULLOGO及DATE CODE，但沒有指明哪層

Question description: In ―work sheet‖ the customer required etch the logo and date code, but no define which Side to etch them.GF Suggestion： We will add it as attached picture indicated.Please confirm!（38）字符超出外形框

Question description: in the topside silkscreen layer, some characters are extended out of the board.(See fig05.pg)GF Suggestion： Follow the Gerber design and we would delete the contents, which have extended out of the board.Please confirm.（39）阻焊層的文本，需要鏡像

Question description：The text ― SOLDER SIDE PWB 3200016 REF B‖ is in its backside if viewed from solder side.(See fig01)GF Suggestion： Mirror these text, please kindly confirm.（40）圖案與字符阻焊重合

Question description： The characters ―0‖ were laid on the copper, solder mask and legend at the same place on the breakaway.GF Suggestion：We would like to delete the character ―0‖ on the legend.5.File，Information，Dimension（1）多余的文件

Question description：There are some introductions files, such as ―Av155302.rep, Av155302.sim, Read me txt, Av155302.fpr‖, exist in the customer‘s data.Because they are not translated into English。We cannot understand what they mean.GF Suggestion： We would ignore them and just follow the Gerber data to build the board.Please confirm.（2）客戶SPEC文件，不存在，繼續使用IPC –A-600F CLASS 2 Question description: the spec BS9763 is shown in the file ―8601284-3-sht1.pdf‖, but we do not have it in hand.(Details see fig01.jpg)GF Suggestion： Ignore the spec and follow IPC –A-600F CLASS 2 to do.Please confirm.（3）我們打不開某個文件

Question description： We cannot open the file‖66-0800-81(4).PDF‖.GF Suggestion：1.Please make it to.JPG format。2.We will disregard this file.Question description： we don‘t unfold “Test point Report forR7597-r4.tsp” and don‘t know the file that is merit or not.GF Suggestion： We suggest ignoring it, please confirming.（4）PDF文件打不開

Question description： We cannot open the file ‖mhtml-mid—00000624-.PDF‖.GF Suggestion：1.Please make it to.JPG format 2.We will disregard this file.Please select.（5）非英文信息

Question description：In technical Specification, we don‘t understand some non-English information that is not translated into English.GF Suggestion：Please kindly confirm.。（6）增加批號等

Question description：Please confirm the format of date code and batch code that customer required to add on the board.GF Suggestion：Please kindly confirm.。

（7）某些文件打不開，建議忽略

GF Suggestion： We will ignore this file, please confirm kindly.Question description：We don‘t how to use the file“PLOT.GBR‖.GF Suggestion ： We will ignore this layer, please confirm kindly.Question description： We can‘t open the file ―A-283-1.GWK‖.（8）客戶提供的資料頁數不夠

Question description：See fig below, you marked the sheet as 1/9, we can‘t make sure。If there are 2/9，3/9?? and so on.We have not found these sheet 2/9, 3/9 and so on.GF Suggestion：We will ignore the sheet 2/9????，please confirm kindly.（9）客戶的版本號不同

Question description：In file ―FAB‖ layer REV D, but we have in file ―SL1‖layer have found REV C.see fig below。

GF Suggestion：We will follow Gerber to build, and ignore this difference, Please confirm kindly.（10）客戶同時提供單元及套板兩種文件

Question description：Both Gerber in unit and in panel form are provided, but not state if we will fabricate per unit Gerber or panel Gerber.GF Suggestion：Fabricate per panel Gerber, and the unit Gerber use for reference only.（11）沒有用的文件

Question description：We considered the explanation indicated in ―63slots.gko‖ was not for us to production, we would like to just follow Gerber data to do, please see enclosed picture.GF Suggestion： Please kindly confirm.（12）C/S面視圖說明

Question description：In the panel drawing, we considered two units shown in panel was view from component side(top side).GF Suggestion： Please kindly confirm。

（13）客戶沒有注明油墨顏色

Question description：We haven‘t found some information about the solder mask color.GF Suggestion：We will print the solder mask in Green color as usual.（14）客戶指定的油墨我司沒有

Question description：You required us to solder mask in color Green(semi-gloss), but we have not had this kind color of solder mask by hand.GF Suggestion：

1、We will use solder mask in color glossy green on both side, please confirm kindly.2、We will use solder mask in color matte green on both sides, please confirm kindly.Question description: We haven‘t had ―SR-1000‖ solder mask by hand.GF Suggestion： We will use the solder mask that we used as usual, please confirm kindly.（15）客戶注明板材我司沒有

Question description：In Gerber file, you defined ― fabricate using F4 material‖, but we don‘t have this material.GF Suggestion：We will ignore this information, we used as usual FR-4 KB material, please confirm kindly.（16）客戶的PO的編號與GERBER中的編號不同

Question description：We found the Cust.P/N‖P17091 ―in PO.Is unmatched that we found in Gerber ―7A80001‖

GF Suggestion： We will follow the Gerber to build, ignore this difference.（17）

Question 客戶所提到的SPEC沒有

description

：

On “PCB_202299_C_yy_zzz_+71_A_Fujitsu_charger PCB.Pdf‖, it noted the spec: ―DIN7168 section 1,Tolerance level middle ―See fig below, but we have not this specification that you mentioned.GF Suggestion：Ignore this spec and follow the specification:IPC-A-600F CLASS 2 to build in this sample the we supplied, but if mass production, please resend the specification ―DIN7168 section 1”.Question description：On drill drawing, it noted the spec: ―BS4584‖,―BS9761 MULTILAYER ― and ―BS219‖(see fig01), but we have not this mentioned spec.GF Suggestion： 1.Please customer provides them A.S.A.P so that we can start our fabrication in time.2.Ignore these mentioned spec and follow the standard of IPC-A-600F CLASS 2 to proceed.（18）客戶提供兩套資料Gerber and PCB Question description：You have supplied two kind of artwork, Gerber and ―*.PCB‖

GF Suggestion：We will ignore this PCB file, follow Gerber to build, please confirm kindly。

（19）SPY/ST的客戶沒有提供圖紙于我們

Question description: We haven‘t received the fab drawing for this board.GF Suggestion :

1、Please send it to us.2、We will ignore this drawing, please confirm kindly.（20）阻焊型號和顏色

Question description：The solder mask type and color was unknown.GF Suggestion： LPI green was acceptable, please kindly confirm.（21）絲印型號和顏色

Question description：The silkscreen mask type and color was not defined.GF Suggestion： Non-conductive ink white was acceptable, please kindly confirm.（22）阻焊油型號澄清

Question description： We thought the type of the solder mask should be ―TAIYO PSR 4000‖ but not ―TAYO PSR 4000‖.GF Suggestion： Please kindly confirm.（23）阻焊顏色

Question description: Note 5: it stated ―????SOLDERMASK TO BE PER IPC-SM-840, TYPE, CLASS 3, COLOR TRANSPARENT GREEN.‖ But we have not had the solder mask in transparent green.GF Suggestion：

1、We will use the solder mask in color glossy green that we used as usual ―LM-600 GH-7‖.2、We will use the solder mask in color matte green that we used as usual, please confirm kindly.（24）沒有定義表面處理

Question description： Didn‘t indicate the surface treatment from our customer.GF Suggestion： HASL + SMOBC was acceptable, please kindly confirm.（25）建議客戶用IPC-A-600F CLASS 2做SPEC Question description：You have not defined some information(like hole size tolerance, dimension tolerance and so on.)GF Suggestion： For this information that you have defined, we will follow specification IPC-A-600F Class 2 to build, don‘t ask again.（26）只有一層阻焊

Question description：Only solder mask bottom side layer in CAD.GF Suggestion： 1.Print solder mask on both sides.But on topside solder mask will cover pad & fall into hole.2.Print solder mask only on bottom layer.Tin/Lead will cover NO solder mask on topside and all conductors and pads.3.Please provide us solder mask topside。4.Use same solder mask for both sides.（27）只有一層阻焊綠油

Question description：Only one solder mask film is in the Gerber file.GF Suggestion： Use this one solder mask file to print on both sides.（28）單面阻焊

Question description：In Gerber file only one solder mask layer.GF Suggestion： We will use the same one solder mask layer on both sides, please confirm kindly.（29）雙面共用一面阻焊

Question description：In file“ FAB‖, you required ―solder mask on both sides of board‖, but we only find one solder mask layer.GF Suggestion: We will print the layer on both sides, Please confirm kindly.Question description：Only provide one side solder mask file in Gerber data。

GF Suggestion:

1、Use same solder mask for both sides 2.Please give other suggestion。

（30）只有三層線路圖形

Question description：Only three copper layers are in the Gerber file, so this board should be three-layer board.If we follow Gerber and build this board as three-layer, the board will have large bow & twist due to unsymmetrical structure.GF Suggestion： 1.Add one copper layer to aid the laminate, and this copper layer will be open with other layers, please kindly confirm.2.Follow Gerber and build this board as three-layer, and the large bow & twist(2.0%)is acceptable.（31）信號層與電源層澄清

Question description： In customer‘s lay-up details, the note for layer 4 is ―1oz Cu/GROUND PLANE‖, but in the original Gerber design, the layer 4 is obviously single layer.(See fig02.jpg and fig03.jpg)GF Suggestion: Ignore the note for layer4 in the lay-up details, and follow the Gerber design to do;the layer 4 is a signal layer.Please confirm.（32）阻抗被要求，但線寬沒有被要求

Question description： The impedance is required in the lay-up details, but it is not shown which line needs to control.GF Suggestion: According to the Gerber design, we would control the 6mil line in the layer1, layer3, layer4 and layer6 with the impedance as 62+/-10%ohms.Please confirm.（33）沒有指明層壓順序

Question description：The layer stack up sequence is not specified.GF Suggestion：We will follow the sequence as a4-283_1_top.ger---a4-283_1_L2.ger--a4-283_1_L3.ger a4-283_1_BOT.ger‖, please confirm kindly.（34）調整層壓結構

Question description：We can‘t meet your impendence requirement according to your lay-up structure.GF Suggestion： We will coordinate the lay-up structure like below（35）關于標準

Question description：“Solder plate per QQ-S-571‖ is mentioned in drawing, but we do not have this spec.GF Suggestion：Disregard this spec, and we will control the solder coat quality with IPC spec.（36）標準

Question description：We haven‘t the standard ―EH&S 1001‖ shown in the *.pdf files.GF Suggestion： 1.We would like to ignore these specs and follow IPC standard.2.Please send them to us.（37）確定D-CODE形狀

Question description：We can‘t make sure the decode shape that you defined ―L‖ ―R‖ ―C‖.GF Suggestion： We will regards ―L‖ as line, ―R‖ as rectangle, ―C‖ as circle, please confirm kindly（38）PN不對

Question description: The cust.P/N ―P1291 ISS A‖ in the Gerber is unmatched with ―P840‖ in the PO.GF Suggestion: We will ignores this difference and follows the Gerber to build, please kindly confirm.（39）建議使用原始Gerber資料做板

Question description：We received original Gerber data and 1-up working Gerber data at the same time, we considered the working Gerber data was only for reference, and we would like to use the original Gerber to build this board.GF Suggestion： Please kindly confirm.（40）客戶有PANEL圖，但沒有注明PANEL尺寸的

Question description：You haven‘t defined the rail size, we can‘t make sure how to build the panel, and so we had a new panel drawing ―2005047A0.PDF‖ and defined the rail size.GF Suggestion：Please confirm the new panel drawing.‖2005047A0.pdf‖ Question description：We have a new panel drawing according to your paste file, but we can‘t make sure the tooling holes size, stamp holes size and fiducially marks size, we have defined the holes size, stamp holes size and fiducially marks size in the panel drawing.GF Suggestion：Please confirm the panel drawing.（41）客戶的傳真與GEBER FILE的拼板尺寸不同

Question description：The panel drawing in Gerber is different from the panel drawing that you faxed, we can‘t make sure follow which to build, but we have drawing a new panel drawing according to the panel drawing that you faxed see file ―2018022A0.pdf‖.GF Suggestion: Please confirm our new panel drawing kindly.Question description: The dimension that you marked in the file ―*.dwg‖ is unmatched that we measured in Gerber data.GF Suggestion：We will follow the dimension that we measured in Gerber data to build.Question description: Two dimensions marked on drawing are not matched with that measured in Gerber.(See fig01)GF Suggestion：Follow Gerber outline to build, please kindly confirm.（42）標注的尺寸與實測不一致

Question description: You told us the panel dimension is 8.20‖X8.20‖in file ―README_ENG-1620-GBZ.txt‖, but we found the panel dimension is 8.02‖X8.02‖.GF Suggestion：We will follow the dimension 8.02‖X8.02‖ to build the panel, please confirm kindly.Question description：The board dimension that you supplied‖0.250 inch‖ is unmatched that we measured in Gerber data ‖0.293 inch‖.GF Suggestion：We will follow the dimension that we measured in Gerber file to build ‖0.293 inch‖, please confirm kindly.（43）PTL的尺寸和Gerber 尺寸不同

Question description：The dimension that you supplied ‖229*280mm‖ is unmatched that we measured in Gerber data ‖228*290mm‖.GF Suggestion：We will follow the dimension that we measured in Gerber file to build ‖228*290mm‖, please confirm kindly.（44）封閉尺寸的詢問

Question description： We can‘t control the dimension shown in the drawing at the same time, because they were in a circle chain, and we would like to take some dimension as reference.GF Suggestion： Please kindly confirm.（45）外形圖中的尺寸與Gerber尺寸不符

Question description：Some dimensions shown in the file ―av155302.pdf‖ page 12 mismatch with what we measured from the Gerber data.(See fig02.jpg)GF Suggestion： Ignore the shown dimension in file ―av155302.pdf‖ and follow the Gerber data to build the board.Please confirm.（46）有一些外形圖中的尺寸，無意義

Question description： We cannot find the corresponding patterns for some dimension shown in the file ―av155302.pdf‖.(See fig02.jpg)GF Suggestion： Ignore them.（47）確認，附圖是交貨板的具體尺寸要求

Question description： Attached ―Panel drawing.jpg‖ is the panel drawing with rails Please kindly confirm.GF Suggestion： Please kindly confirm.（48）外形尺寸不一

Question description: The unit dimension‖72.8mm x50.6mm‖marked in ―P840 read me.txt‖ is unmatched with ―78.49x50.5‖ we measured in the Gerber.GF Suggestion: We will ignore this difference and follow the Gerber to build.（49）尺寸不一致

Question description： We found it‘s mismatched for the dimension shown in the *.gm4 and measured in *gm4.GF Suggestion： We will follow the outline of *.gm4 to build and take the dimensions shown in the *.gm4 as reference.（50）沒有孔到邊的尺寸

Question description： There was no dimension of one hole to the edges, and we can‘t make sure the outline of the board according to the mechanical layer *.gm4.GF Suggestion： Please give further advice.（51）SLOT尺寸不明

Question description：The slot size was unknown, measured from the Gerber data, we would like to build them with 200*325mil.GF Suggestion： Please kindly confirm.（52）蝕刻公差太緊 Question description：You required us the finished trace width should be within 5% of the supplied Gerber, but it is very difficult for us to build.GF Suggestion：Please relax the finished trace width with 20% of the supplied Gerber.（53）把銑出孔的公差由+0.1/-0mm要求放寬到+0.2/-0mm Question description: The tolerance shown in the file ―8601284-3-sht1.pdf ― +0.1/-0mm is tight for us(See fig01.jpg)GF Suggestion: 1.pls kindly relax the tolerance to +0.2/-0mm.2.pls give other advice.（54）板對位公差

Question description:In the file“700-0125-20-A-2.doc‖,note.LAYER TO LAYER REGISTRATION SHALL BE WITHIN 0.003???? GF Suggestion： Please relax the layer-to-layer registration to 0.005‖.Question description:In the file note ‖Layer to layer registration of pattern shall be within 0.004in or 0.1mm‖ and ―with an absolute minimum of 0.002in or 0.05mm between plated…‖, it‘s too tight to control.（55）邊到邊公差

Question description ：It required ―Tolerance +/-0.15‖ in specification;we will control the dimension tolerance of edge to edge as +/-0.15mm.GF Suggestion：Please kindly confirm.6.Profiling（1）內角問題

Question description：We can‘t make the inner angle as right angle, see fig below.GF Suggestion：We will control these inner angle as R0.5mm round corner.Question description：In original design, some inside corners are right angle, it is impossible to make according to our process.GF Suggestion：We will control inside corner as R0.8mm(MAX).（2）SLOT槽的內角

Question description: These slots are rectangle shape, we can‘t make out the inside right angle.GF Suggestion： We will control inside corner as R0.5mm(MAX).（3）SLOT槽的有效長度的詢問

Question description： In Gerber file，there are some square slot in the drawing, but we can‘t make out the square slot because the inner angle is unavoidable.GF Suggestion：

1、We will build the slot as fig A below, please confirm kindly.2、We will build the slot as fig B below, please confirm kindly.（4）V-CUT 客戶沒有設計到兩邊

Question description： In drill drawing V-cut don‘t extend to tab area.GF Suggestion：V-cut extend to tab area。

（5）外圍不同

Question description：The unit outline is unmatched that in panel, see fig below.GF Suggestion：We will follow the panel Gerber to build the outline(file ―ccltop.gbrr‖), and we will ignore the file “ccl.brd”，please confirm kindly.（6）單元太小，建議拼板制作

Question description：The size of unit: 70x70mm is too small;this will go against mass product.GF Suggestion：

1、We will accord to the size of unit, design panel drawing.Detail panel drawing see 4054099a0.pdf,add tooling holesφ2.0mm(3x)and fiducially markφ1.0mm(3x)solder masker openingφ2.0mm).2.We will build these board panel in drawing ―2009018a0.pdf‖, but we will separate these board to units before delivery, please accept little burr at the board edge.3、Please give other suggestion.（7）此板不確定是否需做出V-CUT Question description: In Gerber file, it looks like that the board is consisted of sixteen small board, but the small board profile is absent，and no V-cut between these small board, we can‘t make sure if we need to V-cut between these board with easy to separate the board to small board after diver.GF Suggestion：

1、No need to separate the board to small board , no need to V-cut between these small board, just deliver as a big board, please confirm kindly.2、Please give us your advice.（8）此位臵V-CUT超能力 Question description：You required us to jump V-cut, but there are no enough space.See fig below.GF Suggestion： Please confirm kindly（9）金手指增加鍍金引線

Question description：In Gerber file ―017-065c.dxf‖ layer Gold finger plating bar is different from you file‖ urchaseOrder-05-02-15-GloryFaith-170-00065-003-NXN05-170.pdf‖ them is conflicting, see fig below.GF Suggestion：In order to facilitate in production, we will follow file: *.pdf‖ to add Gold finger plating bar, If reject, we cannot do plating gold finger.Please confirm kindly.（10）鍍金引線殘留

Question description：If question(1)accepted, you required ―up to 0.1mm residual bar), but in Gerber file Gold finger to outline is 75mil distance on bottom side, and we calculate the depth of bevelling edge as 55 mil per the bevelling detail we received, if we follow master Gerber and bevelling detail to build, 0.64mm(max.)Gold plating bar on bottom side will be residual after beveling.GF Suggestion：

1、We will increase the length of the gold finger on both sides so that no residual plating bar after beveling on both side ,but the copper will be exposed on both sides ,please accept this case.2、We will follow master Gerber and the beveling detail we received to build ,and accept 0.64mm(max.)Residual gold plating bar.Question description：In Gerber file the distance from Gold finger to outline is 2.33mm on both side, if we follow master Gerber and bevelling detail to build, gold plating bar on both side will be residual after bevelling.GF Suggestion：We will follow master Gerber and the beveling detail we received to build, and residual bar is allowed, please confirm kindly.（11）金手指角度詢問

Question description：You told us the bevelling angle, but you didn‘t tell us the bevelling depth.GF Suggestion: We will control the beveling depth as 1.0+/-0.15mm, please confirm kindly.See fig below.（12）外形公差太緊

Question description：In file ―FAB‖，you required about the outline tolerance , it is too tight for us to control.See fig below.GF Suggestion：Please relax the outline tolerance from 3mil to 6mil.please confirm kindly.（13）手指離TAB位太近，建議銑入TAB位

Question description： In the Gerber file, the gap between some finger and TAB is too small(only 2.74mm), it will cause that we will bevel the tab, see fig below.GF Suggestion： We will follow the Gerber to build, and allow bevel though the tab.（14）外形尺寸不符合

Question description：We found some dimensions marked in drawing are not matched with that measured the outline in Gerber file.GF Suggestion：We will follow the dimensions marked in drawing, please kindly confirm.（15）外形公差超出我們能力

Question description：In the note 7 of fab layer ―dd0124.pho‖, the tolerance +/-0.002inch for the ―X.Y cord‘s and accompanying cutout‖ is tight for us to control.(See fig01.jpg)GF Suggestion：Please kindly relax to +/-0.004inch.（16）咨詢長方形的長SLOT是否需要鑼出

Question description：You haven‘t supplied the information about the rectangle frame in drill drawing(size 4.051‖x0.464‖), we can‘t make if we need to cut out this rectangle frame.(See fig below)GF Suggestion：We will cut out this area by routing, please confirm kindly.（17）單元內，槽尺寸不符合

Question description: the NPTH slot size we measured from the Gerber data(100*209.5)mismatch with the shown(100*200).(See fig02.jpg)GF Suggestion：1.Ignore the shown dimension and follow cad 1:1 to build.Please confirm.2.Follow the shown dimension(100*200)build the two NPTH slot.（18）外形槽尺寸不符合

Question description: the key slot size we measured mismatch with the shown.(See fig01.jpg)GF Suggestion：1.Ignore the shown dimension and follow the Gerber data to do.Please confirm。2.follow the shown dimension(62*250)to build.（19）V-CUT超出能力，經典

Question description: the v-score angle, remain thickness and width are all shown in the drawing file.But we cannot control the three requirements at the same time.(See fig03.jpg)GF Suggestion： We would control the v-score angle as 30+/-5degree, remain thickness as 0.010+0.08/-0inch, and just make the gap width 0.012inch for reference.Please confirm.（20）外形離PAD、孔太近，允許銑后破孔露銅

Question description: there is no gap between the key slot edge to the copper area.After routed, the copper pad would be exposed and the hole might leads to broken-out.(See fig06.jpg)GF Suggestion： Follow cad and the copper pad exposed and the hole broken-out is acceptable.（21）銑槽與PAD無間距。刮銅6mil Question description：There is no gap between the circuit pad and the routing out rectangle area on the topside circuit layer.(see fig01.jpg)GF Suggestion：1.follow cad and the copper exposed after routing is acceptable.2.shave the circuit pad about 6mil to avoid the copper exposed.（22）無表面處理

Question description： The surface treatment is not shown.GF Suggestion： 1.the surface treatment: HASL(hot air solder level).2.pls give other advice.（23）V-CUT后，允許破孔露銅

Question description： There is no gap for the hole edge to the board profile.After v-cut, the hole would be broken and the copper pad would also be exposed.(See fig03.jpg)GF Suggestion: follow the Gerber design, the hole broken and the copper pad exposed is acceptable.（24）V-CUT超過能力

Question description：Remain thickness tolerance ?+/-3mil‘ and the maximum no registration ?+/-3mil‘for the v-cut are tight for us to control.(See fig04.jpg)GF Suggestion: Please kindly relax remain thickness tolerance to +/-4mil and the maximum no registration to +/-5mil.（25）客戶沒有說是否V-CUT Question description：The set boards have 4 units, but customer didn‘t point how to separate the unit.GF Suggestion：We suggest to separate the board by V-CUT(see fig03)and control as below: Angle: 30+/-5°，remaining thickness: 0.4+/-0.1mm.（26）線路離外形邊太近，移動線路

Question description： On bottom side, there are one trace which is overlap the outline, when profile outline, it will damage this trace(see fig05).GF Suggestion：We suggest shifting this trace into the board so as to keep enough spacing between the outline and the trace.（27）銅面與板邊無間隙，露銅是可接受的，不刮銅

Question description: no gap between the copper area and the board profile, after routed the copper would be exposed.(See fig02.jpg)GF Suggestion： Follow cad and the copper exposed after routing is acceptable.Please confirm.（28）經典4廢1 Question description: for one panel includes 4 physical units, to smooth the mass production, please accept that 1-X out(max)per panel.GF Suggestion： Please confirm.（29）經典9廢1 Question description： Panel shipment 1 panel=9 units.In production some of them maybe scraped, so we suggest that 1 unit X-OUT per panel is acceptable.GF Suggestion： Please confirm.（30）完成板尺寸太小，拼版制作

Question description: Because the size of unit is too small(only: 54x54mm), go against mass product.GF Suggestion：We will accord to the size of unit to build panel drawing(Detail panel drawing see page two, add tooling hole and fiducially mark)Question description：This board is too small to be fabricated, so we will make them in panel.Meanwhile, we want to add three Φ2.0mm tooling holes.Please see attached panel drawing in fig1.GF Suggestion：Please kindly confirm.（31）V-CUT離線太近，移線至16mil，以免露銅

Question description: The gap between the v-cut line and the near circuit pattern is only about 4.0mil, after v-cut, the copper line would be damaged.GF Suggestion：： Move these lines away from v-cut about 16mil to avoid the copper line damaged and exposed.（32）需要客戶確認外形

Question description： Please confirm profiles drawing.GF Suggestion： Please confirm.（33）我司做的拼版外形圖要客戶確認

Question description： Attached ―Panel drawing.jpg‖ is the panel drawing with rails.GF Suggestion： Please confirm it being ok or not.（34）倒邊金手指時，一同倒TAB邊

Question description：The tab is too close to Gold finger tab, the tab will be beveled when beveling gold finger tab, see attached picture.GF Suggestion：Allow bevel the tab together with gold finger tab.（35）表面處理（客戶有ROHS要求，但PO注明為HASL）

Question description：Customer had Rosh requirement, but the surface treatment of HASL can‘t meet the requirement of Rosh in our process, so we would like to use immersion gold for this board but not HASL as requested in customer P/O.GF Suggestion： Please kindly confirm.Question description: You required us the finished treatment as immersion tin in the file of ―P840 read me.txt ―, but it is unmatched with ‖tin lead plate hot air level‖ in the file ―spec.gbr‖, we are not sure which treatment we should to build.GF Suggestion: We will ignore this difference and to build this board as the treatment of the immersion tin, please kindly confirm.（36）ROUT公差

Question description: See the figure below, we did not found the file “P1291AMIL.MIL” and the rout tolerance is tight for us to control.GF Suggestion: We will ignore the file“P1291AMIL.MIL” and only to according the file “rout-path.gbr”, we will control the rout tolerance as +/-0.2mm that you marked in the file ―P840 read me.txt‖

（37）V-CUT Question description: See the figure below, we found you supplied us the integrated rout-path, but we found you designed two v-score in the Gerber at the same time, we think it is not need to v-score, and it may cause burr on the board edge if v-score.GF Suggestion: We will cancel these two v-score, please kindly confirm.（38）銅近OUTLINE Question description: See the figure below, we found some pad and copper is so clear to the outline, it may cause copper and pad exposed after routed.GF Suggestion: 1.We will shave the pad and the copper to get 0.25mm away form the outline and avoid copper or pad exposed.2.We will follow the Gerber to build and copper or pad exposed at the board edge is allowed。

（39）外形不在一條直線上

Question description：We measured at different points of outline in GERBER, but the dimensions were not same, so we will take the outline that base on the GERBER, see ―2008485A0.pdf‖.GF Suggestion：Please kindly confirm.（41）銅皮延伸至板外，導致板邊露銅

Question description：Some copper is extended the outline, it will cause copper exposed at the board edge.GF Suggestion：We will shave copper to get 16mil clearance away from the outline to avoid copper exposed at the board edge.Question description：Some pad is extended the outline, see fig below, it will cause copper exposed at the board edges.GF Suggestion：

1、We will shave pad to get 10mil clearance to avoid copper exposed at the board edge.2、We will follow Gerber to build, copper exposed at the board edge is allowed.（42）線路離外圍太近

Question description： The gap between the outline and the adjacent circuit line is only 1.5mil, after routing.The line would be damaged.See fig below.GF Suggestion:

1、follow Gerber design, and the circuit line damaged after routing is acceptable.2、We will move this circuit(3mil)inside the board, and reduce the circuit size to 18mil to avoid copper exposed, please confirm kindly.3、We will shave copper to get 0.25mm clearance away from the outline to avoid copper exposed.Question description：Some copper is extend of the outline, see fig below, it will cause copper exposed at the board edge GF Suggestion：

1、We will follow Gerber to build, copper exposed at the board edge is allowed.2、We will shave the copper to avoid copper exposed at the board edge.（43）單元報廢的詢問

Question description：Panel shipment 1 panel=18 units.In production some of them maybe scraped, so we suggest that 3 unit X-OUT per panel is acceptable。

GF Suggestion：Please confirm kindly.（44）無OUTLINE Question description：No board outline in the Gerber file.GF Suggestion： Please provide fab.Drawing or board outline to us.（45）內角 Question description: In the panel drawing, some inside corners are right angle, it is impossible to make according to our process.GF Suggestion：We will control inside corner as R1.0mm(MAX).

第二篇：有關PCB(總結)

PCB ：Printed circuit board 印刷電路板

介電層（基材）：Dielectric 用來保持線路與各層之間的絕緣性，俗稱為基材。基材的分類：

由底到高的檔次劃分： 94HB-94V0-22F-(CEM-1)-(CEM-3)-(FR-4)94HB:普通紙板，不防火。（最底檔的材料，不能做電源板。模沖孔。）

94V0:阻燃紙板。（模沖孔）22F : 單面半玻纖板。（模沖孔）

CEM-1:單面玻纖板。（電腦鉆孔，不能模沖孔。）CEM-3:雙面半玻纖板。FR-4:雙面玻纖板。

由阻燃等級劃分：(94V-0)-(94V-1)-(94V-2)-94HB TG:玻璃轉化溫度即熔點。PCB板必須耐燃，在一定溫度下不能燃燒，只能軟化。這時的溫度點即是玻璃轉化溫度。

板材的國家標準：GB/T4721-4722 1992、GB/T4723-4725 1992

板材的TG等級：TG大于等于130度、TG大于等于150度、TG大于等于170度。TG大于等于170度，叫做高TG印刷板。

防焊油墨：Solder Mask / Solder Resistant 并非所有的銅面都要吃錫上元件，因此非吃錫的區域，會印上一層隔絕銅面吃錫的物質（通常為環氧樹脂），被免非吃錫間的線路短路。按不同的工藝：有綠油、紅油、藍油。

表面處理：Surface Finish 由于銅面在一般環境中，很容易氧化導致無法上錫，因此會在吃錫的銅面上進行保護。保護的方式有噴錫（HASL）、化金（EING）、化銀（Immersion Silver）、化錫（Immersion Tin）、有機保焊劑（OSP）。

PCB板材的分類 按板材的剛柔程度分類可分為剛性覆銅箔板和撓性覆銅箔板兩大類 按增強材料的不同分類可分為紙基、玻璃布基、復合基（CEM系列）和特別材料基（陶瓷、金屬基）。

紙基板

酚醛紙基板俗稱紙板、膠板、VO板、阻燃板、紅字覆銅板、94V0、電視板、彩電板等。其中有多個牌子：建滔（KB字符）、長春（L字符）、斗山（DS字符）、長興（EC字符）、日立（H字符）。

酚醛紙基板是以酚醛樹脂為粘合劑，以木槳纖維紙為增強材料的絕緣層壓材料。酚醛紙基板一般可進行模沖加工，成本低價格便宜，相對密度小的優點。酚醛紙基板的工作溫度較低，耐濕性和耐熱性與環氧玻纖布基板相比略低。紙基板是以單面覆銅板為主，但也出現了用銀槳貫通孔的雙面覆銅板產品。牌子有斗山（DS字符）。它在耐銀離子遷移方面，比一般的酚醛紙基覆銅板有所提高，酚醛紙基覆銅紙板最常用的產品型號為FR-1（阻燃型）和XPC（非阻燃型）兩種。單面覆銅紙板從板材后面的字符顏色可以輕易判斷，一般紅字為FR-1（阻燃型），藍字為XPC（非阻燃型）。

環氧玻纖布基板

環氧玻纖布基板俗稱環氧板、環纖板、纖維板、FR4。

環氧玻纖布基板是以環氧樹脂作為粘合劑，以電子級玻璃纖維布作為增強材料的一類基板。它的粘合結片和內芯薄型覆銅板，是制作多層印刷電路板的重要基材。工作溫度較高，本身性能受環境影響小。在加工工藝上，要比其它樹脂的玻璃布基板具有很大的優越性。其中的牌子如生益科技。

復合基板（CEM）

復合基板俗稱粉板、22F。主要是指CEM-1和CEM-3復合基覆銅板。

復合基板CEM-1是以木槳纖維紙或棉槳纖維紙作為芯材增強材料，以玻璃纖維布作為表層增強材料，兩層都浸以阻燃環氧樹脂制成的覆銅板，稱為CEM-1。

復合基板CEM-3是以玻璃纖維紙作為芯材增強材料，以玻璃纖維布作表層增強材料，都浸以阻燃環氧樹脂制成的覆銅板，稱為CEM-3。

阻燃等級：

HB：UL94和CSAC22.No0.17標準中最低的阻燃等級，要求對3到13毫米厚的樣品，燃燒速度小于40毫米每分鐘；小于3毫米的樣品，燃燒速度小于70毫米每分鐘或者在100毫米的標志前熄滅。

V-0：對樣品進行兩次的10秒燃燒測試后，火焰在30秒內熄滅。不能有燃燒物掉下。V-1：對樣品進行兩次的10秒燃燒測試后，火焰在60秒內熄滅。不能有燃燒物掉下。V-2：對樣品進行兩次的10秒燃燒測試后，火焰在60秒內熄滅。可以有燃燒物掉下。

PCB板板材厚度，按國家標準來分有: 0.5mm/0.7mm/0.8mm/1.0mm/1.2mm/1.6mm/2.0mm/2.4mm/3.2mm/6.4mm PCB上的銅箔厚度，按國家標準來分有： 18um/25um/35um/70um/105um 對銅箔的要求金屬純度不低于99.8%，厚度誤差不大于5um.

第三篇：PCB實習總結

單雙面板PCB（Printed circuit Board）工藝制程

一、雙面覆銅板工藝流程

雙面剛性印制板 — 雙面覆銅板 — 開料 — 鉆基準孔 — 數控鉆導通孔— 檢驗 — 去毛刺刷洗 — 化學鍍銅（導通孔金屬化）— 全板電鍍薄銅 —檢驗刷洗 — 網印負性電路圖形— 固化 — 干膜或濕膜 — 曝光 —顯影檢驗—修板—線路圖形電鍍— 電鍍錫 — 抗蝕鎳/金 — 去印料 —感光膜— 蝕刻銅 — 退錫 — 清潔刷洗網印阻焊圖形常用熱固化綠油 — 貼感光干膜或濕膜 — 曝光 — 顯影 — 熱固化 — 常用感光熱固化綠油 — 清洗 —干燥 — 網印標記字符圖形 — 固化 —噴錫或有機保焊膜 — 外形加工 — 清洗 — 干燥—電氣通斷檢測—檢驗包裝 — 成品出廠。

二、流程詳解

1、來料檢驗：

檢測銅箔厚度，板材厚度，板材尺寸，板材表面質量。

2、開料：

目的：將覆銅板剪裁成生產板加工尺寸，方便生產加工。

注意：

A.裁切方式會影響下料尺寸

B.磨邊與圓角的考量-影響影像轉移良率制程

C.方向要一致-即經向對經向，緯向對緯向

3、打定位孔

注意：偏位、孔內毛刺與銅屑、劃傷板面。

4、數控鉆導通孔

鉆孔最重要兩大條件就是“Feeds and Speeds”進刀速度及旋轉速度：

A.進刀速度(Feeds)：每分鐘鉆入的深度，多以吋／分(IPM)表示。上式已為“排屑量”(Chip Load)取代，鉆針之所以能刺進材料中心須要退出相同體積的鉆屑才行，其表示的方法是以鉆針每旋轉一周后所能刺進的吋數(in/R)。當進刀速度約為120in/min左右，轉速為６萬RPM時，其每一轉所能刺入的深度為其排屑量。排屑量高表示鉆針快進快出而與孔壁接觸時間短，反之排屑量低時表示鉆針進出緩慢與孔壁磨擦時間增長以致孔溫升高。

設定排屑量高或低隨下列條件有所不同：

1.孔徑大小 2.基板材料 3.層數 4.厚度

B.旋轉速度(Speeds)：每分鐘所旋轉圈數(Revolution Per Minute RPM)。通常轉數約為６萬－８萬RPM，轉速太高時會造成積熱及磨損鉆針。

例如：2011/2/24日，中試板材鉆孔參數設置如下：進刀速度：3.0m/min，退刀速度:10m/min，旋轉速度：8.5萬RPM。鉆針直徑：0.5mm。

鉆孔作業中會使用的物料有鉆針(Drill Bit)。墊板(Back-up board)。蓋板(Entry board)等。注意事項：

鉆針：成份94%是碳化鎢,，6%左右是鈷，耐磨性和硬度是鉆針評估的重點。其合金粒子愈細能提高硬度以及適合鉆小孔。通常其合金粒子小于1微米（micron）。

墊板：墊板的功用有：a.保護鉆機之臺面，b.防止出口性毛頭(Exit Burr）c.降低鉆針溫度。

d.清潔鉆針溝槽中之膠渣。

蓋板：蓋板的功用有：a.定位 b.散熱 c.減少毛頭 d.鉆頭的清掃 e.防止壓力腳直接壓傷銅面

5、化學鍍銅

目的：使孔壁上之非導體部份之樹脂及玻纖束進行金屬化(metalization)，以進行后來之電鍍銅制程,完成足夠導電及焊接之金屬孔壁。

原理：通過前面的去毛刺刷洗，將孔內的鉆孔鉆污去除，使孔內清潔，后通過活化在表面與孔內吸附膠體鈀，在沉銅缸內發生氧化還原反應，行成銅層附于板面。

工序：上板----堿性除油----水洗----水洗----微蝕----水洗----水洗----預浸----活化----水洗----純水洗----還原----水洗----純水洗----沉銅----水洗----水洗----下板。

注意事項：凹蝕過度，孔露基材，板面劃傷。

6、全板電鍍

目的：對剛沉銅出來的板進行板面、孔內銅加厚到5-8μm，保證在后面的加工過程中不被咬蝕掉。

原理：通過浸酸清潔板面，在鍍銅缸，陽極銅溶解出銅離子在電場的作用下移動到陰極得到電子還原出銅附在板面上，起到加厚銅的作用。

注意：保證銅厚，鍍銅均勻，防止板面劃傷。

7、圖形轉移

目的：把感光油墨印刷在印制板上，通過光合、化學反應把需要的圖形轉移到線路板上面。原理：利用干膜的特點，在一定溫度與壓力作用下膜貼于板面上通過對位曝光，干膜發生反應，形成線路圖形。

工序：來料----磨板----濕膜絲印----烘烤----對位----曝光----顯影----出板。

注意：板面清潔、防止對偏位、底板劃傷、曝光余膠、顯影余膠、板面劃傷。

8、線路圖形電鍍

目的：使線路、孔內銅厚加厚到客戶需要標準。

原理：通過前處理，使板面清潔，在鍍銅、鍍錫缸陽極溶解出銅離子、錫離子，在電場作用下移動到陰極，得到電子，形成銅層、錫層。

工序：來料----除油----微蝕----預浸----鍍銅----浸酸----鍍錫。

注意：鍍銅、鍍錫厚度和均勻性。防止掉錫、手印、撞傷板面。

9、蝕刻

目的：將板面沒有用的銅蝕刻掉，形成有用的線路圖形。

工序：去膜----蝕刻----退錫（水金板不退錫）

原理：在堿液的作用下，將膜去掉露初待蝕刻的銅面，在蝕刻缸銅與銅離子發生反應，生產

亞銅，達到蝕刻作用，在退錫缸內硝酸與錫面發生反應，去掉鍍錫層，露出線路、焊盤、銅面。

注意：防止退膜不盡，蝕刻不盡，過蝕，線變寬，退錫不盡、板面撞傷。

10、蝕檢

目的：利用目視檢查的方法，對照線路圖形找出與板面要求不相符的部分。

11、阻焊

目的：在板面涂上一層阻焊，通過曝光顯影，露出要焊接的盤與孔，其它地方蓋上阻焊層，起到防止焊接短路的作用。

原理：用絲印網將阻焊泥漏印于板面，通過預烘去除揮發，行程膜層，通過對位曝光，被光照的地方阻焊膜交聯反應，沒照的地方在堿液的作用下顯影掉。在高溫下，阻焊完全固化，附于板面。

工序：阻焊前處理----阻焊印刷----阻焊預烤----阻焊顯影----阻焊曝光----阻焊固化。注意：阻焊雜物，對位偏，阻焊上焊盤，阻焊膠，劃傷。

12、網印文字

目的：利用傳統的絲網印刷方式，將客戶所需要的文字符號準確的印到對應的位置。工序：文字絲印----文字烘烤

注意：字符模糊，不清。

13、熱風整平（噴錫）

目的：在裸露的銅面上涂蓋一層錫，達到保護銅面不氧化，利于焊接作用。

原理：通過前處理，清潔銅面的氧化，在銅面上涂一層助焊劑，后在錫爐中錫條與銅反應生成錫鉛銅（或錫銅）合金起到保護銅面利于焊接的作用。

工序：前處理----噴錫----后處理----檢查

注意：孔露銅，焊盤露銅，手指上錫，錫面粗糙，錫面過高。

14、外形

目的：加工成客戶要求的尺寸大小。

成型工藝：沖板，銑板，V-割。

注意：防止放反板，撞傷板，劃傷。

15、電測試

目的：模擬板的狀態，通電進行電性能檢查，是否有開、短路。

注意：漏測，測試機壓傷板面。

16、終檢

目的：對板得外觀、尺寸、孔徑、板厚、標記等檢查，滿足客戶要求。

注意：漏檢，撞傷板面。

17、包裝

目的：板包裝成捆，入庫。

注意：撞傷板，混板。

第四篇：PCB設計總結

設計總結

通過本次設計，我體會到整個設計的流程是從規則設置-----元件布局------過孔扇出與布線-----鋪銅的處理-----走線優化------驗證設計----處理絲印與出GERBER。

在該設計過程中，我出現了很多問題，現歸納如下：

1，對布局的思考太死板，沒考慮到對后面走線的影響。2，走線不夠通順，不能很好的結合原理圖來走線。3，哪些地方該鋪銅，哪些地方不應鋪銅比較模糊。4，軟件設置不夠熟悉。

由此總結幾點要點。

一，關于過孔與鋪銅的總結：

1，過孔盡量打到柵格點上，且保持對齊。

2，大電源部分要多打過孔，對于電感的處理，變壓器的處理要注意。

鋪銅不要超過焊盤下邊緣。

3，銅箔寬度不要太大，5.5~6.5mil,不能小于4.5，不要用整數、4，銅箔寬度盡量保持一致。

5，電源層大電源銅箔挖出一塊區域作為小電源銅箔，可以通過設置其優先級，來達到鋪銅效果。不同電源銅箔間距一致，一般25mil適宜。倒角一般采用45°。二，關于走線的總結：

1，走線不能出現任意角度，一般保持45°角。

2，兩個串聯電容中間走線要加粗。走線間距保持3倍線寬較宜。

3，電源引腳對應的耦合電容要直連，保持電源電路通順。

4，對于FPGA以及數據收發IC的IO口可以通過交換引腳是走線通順。交換時保持數據口對應關系。5，模擬電路與數字電路走線要區分開，防止干擾產生。對應運放電路走線要加粗。6，大電源走線采用星形走線。可通過電源層走線。7，測試點要連入相應的網絡。走線保持同組同層。

8，接插件中間盡量不走線。出線保持間距一致，走完的線可以通過鎖定防止誤操作，做到美觀統一。

第五篇：PCB工藝總結

PCB工藝總結：

第一章、原材料

1、基板：一般印制電路板用基板材料可分為兩大類：剛性基板材料和柔性基板材料。一般剛性基板材料的重要品種是覆銅板。它是用增強材料(包括玻纖布基覆銅板；紙基覆銅板；復合基覆銅板，另外還有特殊增強材料構成的覆銅板還有：芳酰胺纖維無紡布基覆銅板、合成纖維基覆銅板等)，浸以樹脂膠黏劑（即絕緣材料，酚醛樹脂、環氧樹脂(EP)、聚酰亞胺樹脂(PI)、聚酯樹脂(PET)、聚苯醚樹脂(PPO或)、氰酸酯樹脂(CE)、聚四氟乙烯樹脂(PTFE)、雙馬來酰亞胺三嗪樹脂(BT)），通過烘干、裁剪、疊合成坯料，然后覆上銅箔，用鋼板作為模具，在熱壓機中經高溫高壓成形加工而制成的。一般的多層板用的半固化片，則是覆銅板在制作過程中的半成品(多為玻璃布浸以樹脂，經干燥加工而成)。

2、銅箔：覆銅板的銅箔在出廠前需要進行表面處理。（有電鍍銅箔和碾壓銅箔，后者主要用在撓性產品中。）A 傳統處理

a、瘤化處理：在粗面迅速鍍一層銅 b、是否鍍鋅、鍍鎳處理 c、是否進行鈍化處理

3、防焊漆：主要作用是留出板上等焊的通孔及PAD(錫墊),將其它的線路及銅面蓋住，防止波焊時造成短路；防止濕氣及各種電解質侵害線路、防止外來的機械傷害；絕緣功能。

防焊油漆顏色有綠、黃、白、黑。種類主要有環氧樹脂IR烘烤型、UV硬化型、液態感光型，干膜防焊漆。

環氧樹脂IR烘烤型：

UV硬化型：

液態感光型：液態感光雙組份防焊油墨吧，其主要成份是：樹脂，色粉，銅面促進劑，消泡劑，穩定劑等

干膜防焊漆：

4、油墨：

第二章 生產工工藝

一、內層制作工藝

1、裁板、磨邊：將一張大料根據不同拼板要求用機器切成小料的過程。開料后的板邊尖銳，容易劃傷手，同時使板與板之間擦花，所以開料后再用磨邊機磨邊。

2、銅面處理：在印刷電路板制程中不管那一個步驟，銅面的清潔與粗化的效果關系著下一工序的成敗。以下工序需要進行銅面處理： a.干膜壓膜；b.內層氧化處理前； c.鉆孔后；d.化學銅前；e.鍍銅前；

f.綠漆前；g.噴錫(或其它焊墊處理流程)前；h.金手指鍍鎳前

除a.c.f.g.外，其余工序的銅面處理皆屬制程自動化中的一部分。（1）銅面處理工藝（a.刷磨法、b.噴砂法、c.化學法）1刷磨法：需要做刷良試驗，確定刷深及均勻性。○

a、優點： 成本低、制程簡單彈性；

b、缺點： 薄板細線路板不易進行、基材拉長不適內層薄板、刷痕深時易造成D/F附著不易而滲鍍、有殘膠之潛在可能

c、工藝流程：利用刷磨均勻拋刷銅面其平整且刷痕一致，獲得均勻的粗糙度，對油墨有良好的附著力。刷磨輪分三種： 尼龍刷磨；白毛清洗刷磨（無研磨劑）、不織布刷磨輪；

2.噴砂法：噴砂材料由70%礦物化火山巖組成，去除氧化物，粗糙銅面。○3 化學微蝕法（發展趨勢，因為產品向著超薄方向發展）：只針對內層薄片○（厚度小于8mil）使用。有時與刷磨工序聯合使用。主要微蝕液為sps(過硫酸鈉)+硫酸，過硫酸銨+硫酸體系;雙氧水+硫酸體系.微蝕速度40～60u/s.3、圖像轉移

（1）印刷法（將逐步被干膜法替代）：下列是目前尚可以印刷法cover的制程: a.單面板之線路,防焊(大量產多使用自動印刷,以下同)b.單面板之碳墨或銀膠 c.雙面板之線路,防焊 d.濕膜印刷 e.內層大銅面 f.文字

g.可剝膠(Peelable ink)（2）絲網印刷：

絲網印刷中幾個重要基本原素:網材,網版,乳劑,曝光機,印刷機,刮刀,油墨,烤箱等,.a.網布材料

(1)依材質不同可分絲絹(silk),尼龍(nylon),聚酯(Polyester,或稱特多龍),不銹鋼,等.電路板常用者為后三者.(2)編織法:最常用也最好用的是單絲平織法 Plain Weave.b.網版(Stencil)的種類

(1).直接網版(Direct Stencil)將感光乳膠調配均勻直接涂布在網布上烘干后連框共同放置在曝光設備臺 面上并覆以原稿底片再抽真空使其密接感光經顯像后即成為可印刷的網 版通常乳膠涂布多少次,視印刷厚度而定.此法網版耐用,安定性高,用于大 量生產.但制作慢,且太厚時可能因厚薄不均而產生解像不良.(2).間接網版(Indirect Stencil)把感光版膜以曝光及顯像方式自原始底片上把圖形轉移過來然后把已有圖 形的版膜貼在網面上待冷風干燥后撕去透明之載體護膜即成間接性網版 其厚度均勻,分辨率好,制作快,多用于樣品及小量產.c.油墨

油墨的分類有幾種方式(1).以組成份可分單液及雙液型.(2).以烘烤方式可分蒸發干燥型化學反應型及紫外線硬化型(UV)(3).以用途可分抗蝕,抗鍍,防焊,文字,導電,及塞孔油墨.不同制程選用何種油墨,須視各廠相關制程種類來評估,如堿性蝕刻和酸性蝕刻 選擇之抗蝕油墨考慮方向就不一樣.d、烘烤

不同制程會選擇不同油墨, 烘烤條件也完全不一樣,須根據廠商提供的 data sheet,再依廠內制程條件的差異而加以修改.一般因油墨組成不一 烘烤方式有風干,UV,IR等烤箱須注意換氣循環溫控時控等.3、干膜法：

4、蝕刻：用于蝕刻的化學藥液種類常見者有兩種：一是酸性氯化銅(CuCl2)蝕刻液，一種是堿性氨水蝕刻液，主要配方見下圖：

酸性蝕刻液中CU2+濃度控制：

a.CuCl2酸性蝕刻反應過程之分析

銅可以三種氧化狀態存在原子形成Cu°, 藍色離子的Cu++以及較不常見 的亞銅離子Cu+金屬銅可在銅溶液中被氧化而溶解見下面反應式1 Cu°+Cu++2 Cu+-------------(1)在酸性蝕刻的再生系統就是將Cu+氧化成Cu++,因此使蝕刻液能將更多的 金屬銅咬蝕掉

以下是更詳細的反應機構的說明 b.反應機理及過程

直覺的聯想在氯化銅酸性蝕刻液中Cu++ 及Cu+應是以CuCl2 及CuCl存 在才對但事實非完全正確兩者事實上是以和HCl形成的一龐大錯化物存 在的

Cu° + H2CuCl4 + 2HCl 2H2CuCl3-------------(2)金屬銅 銅離子 亞銅離子

其中H2CuCl4 實際是 CuCl2 + 2HCl 2H2CuCl3 實際是 CuCl + 2HCl 在反應式(2)中可知HCl是消耗品即使(2)式已有些復雜但它仍是以下兩 個反應式的簡式而已

Cu°+ H2CuCl4 2H2CuCl3 + CuCl(不溶)----------(3)CuCl + 2HCl 2H2CuCl3(可溶)----------(4)式中因產生CuCl沈淀會阻止蝕刻反應繼續發生但因HCl的存在溶解 CuCl維持了蝕刻的進行由此可看出HCl是氯化銅蝕刻中的消耗品而且 是蝕刻速度控制的重要化學品。

1)蝕刻機理：

Cu+CuCl2→Cu2Cl2 Cu2Cl2+4Cl-→2(CuCl3)2-

2)影響蝕刻速率的因素：影響蝕刻速率的主要因素是溶液中Cl-、Cu+、Cu2+的含量及蝕刻液的溫度等。a、Cl-含量的影響：溶液中氯離子濃度與蝕刻速率有著密切的關系，當鹽酸濃度升高時，蝕刻時間減少。在含有6N的HCl溶液中蝕刻時間至少是在水溶液里的1/3，并且能夠提高溶銅量。但是，鹽酸濃度不可超過6N，高于6N鹽酸的揮發量大且對設備腐蝕，并且隨著酸濃度的增加，氯化銅的溶解度迅速降低。添加Cl-可以提高蝕刻速率的原因是：在氯化銅溶液中發生銅的蝕刻反應時，生成的Cu2Cl2不易溶于水，則在銅的表面形成一層氯化亞銅膜，這種膜能夠阻止反應的進一步進行。過量的Cl-能與Cu2Cl2絡合形成可溶性的絡離子(CuCl3)2-，從銅表面上溶解下來，從而提高了蝕刻速率。b、Cu+含量的影響：根據蝕刻反應機理，隨著銅的蝕刻就會形成一價銅離子。較微量的Cu+就會顯著的降低蝕刻速率。所以在蝕刻操作中要保持Cu+的含量在一個低的范圍內。c、Cu2+含量的影響：溶液中的Cu2+含量對蝕刻速率有一定的影響。一般情況下，溶液中Cu2+濃度低于2mol/L時，蝕刻速率較低；在2mol/L時速率較高。隨著蝕刻反應的不斷進行，蝕刻液中銅的含量會逐漸增加。當銅含量增加到一定濃度時，蝕刻速率就會下降。為了保持蝕刻液具有恒定的蝕刻速率，必須把溶液中的含銅量控制在一定的范圍內。d、溫度對蝕刻速率的影響：隨著溫度的升高，蝕刻速率加快，但是溫度也不宜過高，一般控制在45~55℃范圍內。溫度太高會引起HCl過多地揮發，造成溶液組分比例失調。另外，如果蝕刻液溫度過高，某些抗蝕層會被損壞。

5、剝膜：剝膜在pcb制程中有兩個工序會使用：一是內層線路蝕刻后之D/F剝除，二 是外層線路蝕刻前（剝除(若外層制作為負片制程)）。化學藥液多為NaOH或KOH濃 度在1~3%重量比。內層之剝膜后有加 酸洗中和也有防銅面氧化而做氧化處理者。

6、AOX檢測：內層板線路成完后,必須保證通路及絕緣的完整性(integrity),即如同單面板一樣先要仔細檢查因一旦完成壓合后,不幸仍有缺陷時,則已為時太晚,對于高層次板子而言更是必須先逐一保證其各層品質之良好,始能進行壓合, 由于高層板漸多,內層板的負擔加重,且線路愈來愈細,萬一有漏失將會造成壓合后的昂貴損失.傳統目視外,自動光學檢查(AOI)之使用在大廠中已非常普遍, 利用計算機將原圖案牢記,再配合特殊波長光線的掃瞄,而快速完美對各層板詳作檢查但AOI有其極限,例如細斷路及漏電(Leakage)很難找出,故各廠漸增加短斷路電性測試。

7、壓合：

（1）表面氧化處理：

A.增加與樹脂接觸的表面積,加強二者之間的附著力(Adhesion).B.增加銅面對流動樹脂之潤濕性,使樹脂能流入各死角而在硬化后有更強的抓地力

C.在裸銅表面產生一層致密的鈍化層(Passivation)以阻絕高溫下液態樹脂中胺類(Amine)對銅面的影響

主要有黑化與棕化工藝：

黑化：黑化工藝：它是一種氧化處理在堿性介質中的一種化學反應，使得樹脂與銅面的接觸面積增大，結合力加強。在化學反應中通常使用強氧化劑亞氯酸鈉（NaclO2）、高錳酸鉀（K2MnO4)等,以NaclO2化學反應為例： 4Cu+NaCLO2------2Cu2O+NaCL 2Cu2O+NaCLO2------4CuO+NaCL 黑氧化處理的產物主要是氧化銅(CuO)，黑化層因液中存有高堿度而雜有Cu2O,此物容易形成長針狀或羽毛狀結晶。此種亞銅在高溫下容易折斷而大大影響銅與樹脂間的附著力, 并隨流膠而使黑點流散在板中形成電性問題,而且也容易出現水份而形成高熱后局部的分層爆板。黑化因結晶較長，厚度較厚，一般銅面的瑕疵較容易蓋過去而能得到色澤均勻的外表。但光面的黑化層卻容易受酸液之側攻而現出銅之原色,有些人認為黑化的產物是氧化銅和氧化亞銅，這是業內的一些錯誤論調，經過分析，可以測定銅原子和氧原子之間的結合能，氧化物表面銅原子和氧原子之間的比例；

黑化同時也帶來了一種缺陷，黑化層較厚,經PTH后常會發生粉紅圈, 這是因 PTH中的微蝕或活化或速化液攻入黑化層而將之還原露出原銅色之故。對于粉紅圈的處理又分為還原法和溶解法，其解決方法是提高黑化膜的抗酸能力，但是整個生產成本明顯增高。

棕化：棕化過程是銅在一種酸性的介質中的一種化學反應，棕化處 理的產物主要是氧化亞銅（CU20），棕化層則呈碎石狀瘤狀結晶貼銅面,其結構緊密無疏孔,與膠片間附著力遠超過黑化層,不受高溫高壓的影響,成為聚亞醯胺,另外氧化亞銅膜具有致密、完整、均勻提供一致性的粗糙度，為下一步有機金屬轉化膜提供了良好的物理結構。

棕化液的組成[3~6]：

① 硅烷類化合物，特別是易水解成膜的硅烷偶聯劑，使用一種或多種，有些不易溶于水，需要使用醇類有機溶劑，輔助溶解，最佳使用濃度質量百分比1%-5%(未水解時的濃度)。加入棕化液前，令硅烷部分或完全水解。水解處理就是把硅烷與酸性水混合攪拌，或者與含醇類化合物的水混合。

② 唑、吡咯等化合物。咪唑、苯并咪唑、三唑、苯并三唑等衍生物。如1,2,3-三唑，1,2,4-三唑，3-甲基-1,2,4-三唑，羥基苯并三唑等。使用濃度：重量百分比0.1%-10%。最佳1%-3%。

③ 氧載體。如過氧化氫。有助于唑類化合物吸附于銅表面，若缺少，則唑類化合物無法吸附于銅面上。原因：很薄的一層銅被氧氧化后，銅表面很可能首先形成了銅-唑類化合物。用量：重量百分比0.1%-5%，最好1%-2%。太少則處理時間過長，太多則微蝕過度。過氧化氫在這里的作用不是微蝕形成粗糙銅，而是去除一薄層銅，有利于有機銅層的沉積，該層能有效地提高結合力。

④ 有機或無機酸。如硫酸、磷酸、硝酸，醋酸、甲基磺酸、乙醇酸、檸檬酸等。其中硫酸最好，成本低，不會增加廢液處理難度。硫酸作用：一方面有利于硅烷水解，另一方面有利用去除一薄層銅。使用濃度：重量百分比1%-40%，最好5%-15%。

⑤ 鋅化合物。可溶性的有機或無機鋅鹽。如硝酸鋅、硫酸鋅、磷酸鋅、醋酸鋅、甲烷磺酸鋅。使用濃度：重量百分比0.01%-20%。最佳0.2%-2%。作用：在銅面吸附的第一層唑類化合物與后續吸附的唑類化合物之間，鋅化合物參與形成配位絡合物，這樣可以形成足夠厚的沉積層，該沉積層表現為暗棕色，適合應用于線路板制造。如果不使用鋅化合物，則沉積層厚度很薄、顏色很淡，并且沉積層非常不均勻。

⑥ 過氧化氫穩定劑：苯磺酸、乙二胺四乙酸、巰基乙酸、硅酸鈉。重量百分比濃度0.001%-1%，依穩定劑種類不同，選擇相應濃度。

棕化工序：堿清洗→DI水洗→預浸液→棕化液→DI水洗→烘干。堿洗目的是除去銅表面的有機殘渣和輕微的氧化層。預浸目的是保證銅表面的化學活潑性，使棕化變得快速和均勻，其中棕化是整個生產線的關鍵。

工藝條件：

① 使用PVC或聚四氟乙烯槽，采用搖擺或輕微攪拌。② 浸漬或水平噴淋。③ 處理溫度為 30℃～38℃。溫度低則耗時長，溫度高則銅易微蝕過度，且過氧化氫會分解。④ 處理時間為30秒～75秒(水平噴淋)。

各組分的作用 ① 硫酸：幫助雙氧水微蝕銅，水解含OH的有機聚合物，使其中的R基團變為H，以增強有機聚合物與銅的結合力。② 雙氧水作用是蝕刻一層很薄的銅，促使有機金屬層沉積在金屬銅面上。過硫酸銨(鈉)等也可以使用，但文獻認為雙氧水更好[7]。

③ 含OH的有機A：其與相同分子之間反應的同時與半固化環氧樹脂聚合；同時與含N 的雜環化合物B、金屬銅(含OH)形成化學鍵。

④ 含N的雜環化合物B：與基體銅結合外，通過A的橋鍵與環氧樹脂結合，含N的雜環化合物分子間通過銅離子以配位鍵的形式連接起來，增加了棕化層的厚度和平整性。⑤ 氯離子：對板子的顏色、微蝕厚度、抗撕強度有很大影響。需要監測其濃度。⑥ 3,5-二硝基水楊酸等含硝基的有機化合物[7]，可以與金屬表面反應，特別是銅和銅合金，以提供均勻的金屬轉化層，該層有利于和聚合物材料成鍵。

棕化液再生：棕化處理是一個化學蝕銅反應過程，隨著棕化生產的進行，棕化液中的銅離子濃度不斷上升，當銅離子超過一定限量后，棕化液便會因銅離子過多而產生棕化銅面發白、棕化銅面色澤不均等品質問題，因此，此時棕化槽液必須進行處理，使銅離子控制在一定范圍內，從而保證棕化產品的品質。通常棕化過程中銅離子濃度達到一定限量后，需要不斷排放棕化液，同時補充添加液以降低銅離子濃度，且保持棕化槽各有效組分含量的穩定。為了提高棕化液的利用率，可以收集排放的棕化液A，經過除銅和調整處理后作為棕化添加液B使用，即將棕化液A經過濃縮，成為銅離子含量較高的濃縮液，然后經過冷卻結晶析出硫酸銅晶體，使溶液銅離子含量降低，最后通過對棕化液有效成分分析調整，得到添加液B，再添加到棕化生產過程中，達到棕化液循環使用的目的。

主要工藝流程：A.堿性清洗-也有使用酸洗.市售有多種專業的化藥,能清除手指紋油脂,scum或有機物

B.酸浸-調整板面PH,若之前為酸洗,則可跳過此步驟.C.微蝕-微蝕主要目的是蝕出銅箔之柱狀結晶組織(grain structure)來增加表面積,增加氧化 后對膠片的抓地力通常此一微蝕深度以50-70微英吋為宜微蝕對棕化層的顏色均勻上非 常重要, D.預浸中和-板子經徹底水洗后,在進入高溫強堿之氧化處理前宜先做板面調整 ,使新鮮的銅 面生成-暗紅色的預處理,并能檢查到是否仍有殘膜未除盡的亮點存在

E.氧化處理-市售的商品多分為兩液,其一為氧化劑常含以亞氯酸鈉為主,另一為氫氧化鈉及添 加物,使用時按比例調配加水加溫即可通常氫氧化鈉在高溫及攪動下容易與空氣中的二氧化 碳形成碳酸鈉而顯現出消耗很多的情況,因堿度的降低常使棕化的顏色變淺或不均勻,宜分析 及補充其不足溫度的均勻性也是影響顏色原因之一,加熱器不能用石英,因高溫強堿會使硅 化物溶解操作時最好讓槽液能合理的流動及交換

F.還原此步驟的應用影響后面壓合成敗甚巨.G.抗氧化此步驟能讓板子的信賴度更好,但視產品層次,不一定都有此步驟.H.后清洗及干燥-要將完成處理的板子立即浸入熱水清洗,以防止殘留藥液在空氣中干涸在板面 上而不易洗掉,經熱水徹底洗凈后,才真正完工（2）、疊板

膠片相態變化：膠片中的樹脂為半硬化的 B-Stage 材料,在受到高溫后即會軟化及流動,經過一段軟化而流動 的時間后,又逐漸吸收能量而發生聚合反應使得黏度增大再真正的硬化成為 C-Stage 材料。壓合機種類：

a、艙壓式壓合機：壓合機構造為密閉艙體，外艙加壓、內袋抽真空受熱，壓合成型。各層板材所承受之熱力與壓力來自四面八方加壓加溫之惰性氣體

優點: 因壓力熱力來自于四面八方故其成品板厚均勻流膠小可使用于高樓層

缺點: 設備構造復雜成本高且產量小

b、液壓式壓合機：液壓式壓合機構造有真空式與常壓式。其各層開口之板材夾于上下兩熱壓盤間，壓力由下往上壓，熱力藉由上下熱壓盤加熱傳至板材。優點:a.設備構造簡單成本低且產量大 b.可加裝真空設備有利排氣及流膠 缺點: 板邊流膠量較大板厚較不均勻 C.ADARA SYSTEM Cedal 壓合機 Cedal為一革命性壓合機，其作動原理為在一密閉真空艙體中利用連續卷狀銅箔迭板。在兩端通電流,因其電阻使銅箔產生高溫,加熱。Prepreg用熱傳系數低之材質做壓盤，藉由上方加壓達到壓合效果。因其利用夾層中之銅箔加熱，所以受熱均勻，內外層溫差小，受壓均勻。比傳統式壓合機省能源故其操作成本低廉。優點: a.利用上下夾層之銅板箔通電加熱省能源操作成本低 b.內外層溫差小受熱均勻產品品質佳 c.可加裝真空設備有利排氣及流膠 d.Cycle time短約4Omin.e.作業空間減小很多.f.可使用于高樓層

缺點: 設備構造復雜成本高且單機產量小迭板耗時 壓合機熱源：

a、電加熱式：于壓合機各開口中之壓盤內安置電加熱器直接加熱 優點: 設備構造簡單成本低保養簡易

缺點: a.電力消耗大；b.加熱器易產生局部高溫使溫度分布不均 b、加熱軟水使其產生高溫高壓之蒸汽直接通入熱壓盤： 優點: 因水蒸汽之熱傳系數大熱媒為水較便宜

缺點: a.蒸氣鍋爐必需專人操作設備構造復雜且易銹蝕,保養麻煩；b.高溫高壓操作危險性高

C.藉由耐熱性油類當熱媒以強制對流方式輸送將熱量以間接方式傳至熱壓盤 優點: 升溫速率及溫度分布皆不錯操作危險性較蒸汽式操作低 缺點: 設備構造復雜價格不便宜保養也不易 D.通電流式: 利用連續卷狀銅箔迭板在兩端通電流因其電阻使銅箔產生高溫加熱Prepreg用熱傳系數低之材質做壓盤減少熱流失

優點: a.升溫速率快(35/min.)內外層溫差小及溫度分布均勻；b.省能源操作成本低廉

缺點: a.構造復雜設備成本高 疊板結構：

若壓合機有十二個開口，每一開口有上下熱壓盤，共十三個熱壓盤。迭板方式以鋼質載盤為底盤，放入十二張牛皮紙及一張銅箔。基板中間以一層鏡面鋼板一層板材的方式迭入十二層板材，上面再加一層鏡面鋼板及一張銅箔基板和十二張牛皮紙再蓋上鋼質蓋板.A-1 迭板結構各夾層之目的

a.鋼質載盤,蓋板(Press plate): 早期為節省成本多用鋁板,近年來因板子精密度的提升已漸改成硬化之鋼板,供均勻傳熱用.b.鏡面鋼板(Separator plate): 因鋼材鋼性高, 可防止表層銅箔皺折凹陷，拆板容易。鋼板使用后如因刮傷表面或流膠殘留無法去除，就應加以研磨。

c.牛皮紙: 因紙質柔軟透氣的特性可達到緩沖受壓均勻施壓的效果,且可防止滑動。因熱傳系數低可延遲熱傳均勻傳熱之目的，在高溫下操作牛皮紙逐漸失去透氣的特性,使用三次后就應更換。

d.銅箔基板:其位于夾層中牛皮紙與鏡面鋼板之間，可防止牛皮紙碳化后污染鏡面鋼板或黏在上面，緩沖受壓均勻施壓

e.其它有脫模紙(Release sheet)及壓墊(Press pad)Conformal press的運用,大半都用在 軟板coverlayer壓合上.壓板過程中壓力變化：

a.初壓(吻壓 Kiss pressure):每冊(Book)緊密接合傳熱,驅趕揮發物及殘余氣體

b.第二段壓:使膠液順利填充并驅趕膠內氣泡，同時防止一次壓力過高導致的皺折及應力

c.第三段壓:產生聚合反應使材料硬化而達到C-stage d.第四段壓:降溫段仍保持適當的壓力，減少因冷卻伴隨而來之內應力 壓板后處理： a、后烤：通常后烤條件是150,4小時以上.如果先前壓合步 驟curing很完整,可不做后烤,否則反而有害(降低Tg).目的：a.讓聚合更完全.b.若外表有彎翹,則可平整之.c.消除內部應力并可改善對位.B.銑靶,打靶-完成壓合后板上的三個箭靶會明顯的出現浮雕(Relief), 手動作業:將之置于普通的單軸鉆床下用既定深度的平頭銑刀銑出箭靶及去掉原貼的耐熱膠 帶,再置于有投影燈的單軸鉆床或由下向上沖的沖床上沖出靶心的定位孔,再用此定位孔定 在鉆床上即行鉆孔作業注意要定時校正及重磨各使用工具, b.X-Ray透視打靶: 有單軸及雙軸,雙軸可自動補償取均值,減少公差.C.剪邊(CNC裁板)：-完成壓合的板子其邊緣都會有溢膠,必須用剪床裁掉。以便在后續制程中作業方便及避免造成人員的傷害,剪邊最好沿著邊緣直線內1公分處切下,切太多會造成電鍍夾點的困擾,最好再用磨邊機將四個角落磨圓及邊緣毛頭磨掉,以減少板子互相間的刮傷及對槽液的污染。或者現在很普遍直接以CNC成型機做裁邊的作業。

8、鉆孔

鉆孔房環境設計

A.溫濕度控制： 一般鉆房的溫度應控制在18-22℃、相對濕度≦50€?當溫濕度不符合要求，會影響鉆機的性能表現。

B.干凈的環境：鉆房環境力求清潔。鉆機清理時不可使用高壓風槍吹塵，此舉一方面會影響操作員健康，另一方面會影響鉆機的壽命及精度。

C.地板承受之重量 D.絕緣接地的考量 E.外界振動干擾

鉆孔過程使用的物料：

鉆針(a.硬度高耐磨性強的碳化鎢（94%b.耐沖擊及硬度不錯的鈷（4%）、c.有機黏合劑）、蓋板、墊板。

9、鍍通孔：

其目的使孔壁上之非導體部份之樹脂及玻纖束進行金屬化(metalization), 以進行后來之電鍍銅制程,完成足夠導電及焊接之金屬孔壁。主要包括以下幾個步驟：

（1）去巴里：鉆完孔后,若是鉆孔條件不適當,孔邊緣有1.未切斷銅絲2.未切斷玻纖的殘留,稱為burr.因其要斷不斷,而且粗糙,若不將之去除,可能造成通孔不良及孔小,因此鉆孔后會有de-burr制程.也有de-burr是放在Desmear之后才作業.一般de-burr是用機器刷磨,且會加入超音波及高壓沖洗的應用.（2）除膠渣(Desmear)A.目的: a.去膠渣

b.創造表面粗糙的微孔，增加結合力。B.Smear產生的原因: 由于鉆孔時造成的高溫Resin超過Tg值而形成融熔狀終致產生膠渣 此膠渣生于內層銅邊緣及孔壁區會造成P.I.(Poor lnterconnection)C.除膠渣的四種方法: 硫酸法(Sulferic Acid)、電漿法(Plasma)、鉻酸法(Cromic Acid)、高錳酸鉀法(Permanganate).a.硫酸法：必須保持高濃度但硫酸本身為脫水劑很難保持高濃度且咬蝕出的孔面光滑無微孔，并不適用。

b.電漿法：效率慢且多為批次生產，而處理后大多仍必須配合其它濕制程處理。因此除非生產特殊板大多不予采用。

c.鉻酸法：咬蝕速度快，但微孔的產生并不理想，且廢水不易處理又有致癌的潛在風險故漸，被淘汰

d.高錳酸鉀法：因配合溶劑制程可以產生微孔同時由于還原電極的推出使槽液安定性獲得較佳控制因此目前較被普遍使用。

高錳酸鉀法(KMnO4 Process)簡介: A.膨松劑(70度，主要成分氫氧化鈉、已二醇乙醚、已二醇，5min): a.功能:軟化膨松Epoxy降低 Polymer 間的鍵結能使KMnO4 更易咬蝕形成 Micro-rough 速 率 作 用 Concentration b.不可和KMnO4 直接混合以免產生強烈氧化還原發生火災 c.原理解釋:(1)初期溶出可降低較弱的鍵結，使其鍵結間有了明顯的差異。若浸泡過長，強的鏈接也漸次降低，終致整塊成為低鏈接能的表面。如果達到如此狀態將無法形成不同強度結面。若浸泡過短則無法形成低鍵結及鍵結差異如此 將使KMnO4咬蝕難以形成蜂窩面，終致影響到PTH的效果。

(2)表面張力的問題: 無論大小孔，皆有可能有氣泡殘留。而表面力對孔內濕度也影響頗大。故 采用較高溫操作有助于降低表面張力及去除氣泡。至于濃度的問題，為使Drag out降低減少消耗而使用略低濃度，事實上較高濃度也可操作且速 度較快

在制程中必須先濕潤孔內壁以后才能使藥液進入作用。否則有空氣殘留后續制程更不易進入孔內其Smear將不可能去除

B.除膠劑(80度): a.使用KMnO4的原因:選KMnO4而未選NaMnO4是因為KMnO4溶解度較佳,單 價也較低

b.反應原理: 4MnO4-+ C + 4OH-=MnO4 + CO2 + 2H2O(此為主反應式)2MnO4-+ 2OH-2MnO4= + 1/2 O2 + H2O(此為高PH值時自發性分解反應)MnO4-+ H2O MnO2 + 2OH-+ 1/2 O2(此為自然反應會造成Mn+4沉淀)c.作業方式:早期采氧化添加劑的方式。目前多用電極還原的方式。操作不穩 定的問題已獲解決

d.過程中其化學成份狀況皆以分析得知但Mn+7為紫色, Mn+6為綠色,Mn+4 為黑色可由直觀的色度來直接判斷大略狀態若有不正常發生則可能 是電極效率出了問題須注意

除膠劑再生：KMnO4的再生：要提高KMnO4工作液的使用效率，必須考慮將溶液中的MnO4 2-再生轉變為MnO4-，目前

普遍采用的是電解再生法，再生器利用的是陰極為大面積的不銹鋼柱形圓筒，陽極為鈦材料，其與陰極的面積比很小，MnO4-2-在陽極表面發生的反應為MnO4-2--e→MnO4-。使用450~~550A的整流器，由于MnO4 2-不斷地氧化成MnO4-，因此工作液中不需大量添加KMnO4原料，它的少量添加是為了平衡工作液的帶出損耗，因而大大降低了生產成本，使用較長時間的工作液在槽底會形成沉淀，需定期清除，以保證處理效果。

MLB214D為樹脂蝕刻促進劑，可提高KMnO4的樹脂蝕刻能力，提高工作液的潤濕性，減少孔內氣泡，其為白色粉末狀固體。

C.中和劑(40度):由于錳是重金屬，它的存在會使鈀中毒，使鈀離子或原子失去活化性能。必須把Mn7+/ Mn6+/MnO2用酸中和成為Mn2+，反應機理如下：

a.NaHSO3是可用的中和之一。其原理皆類似Mn or Mn+6 or Mn+4(Neutralizer)->Mn+2(Soluable)b.為免于粉紅圈，在選擇Acid base必須考慮。HCl及 H2SO4系列都有。但Cl易攻擊氧化層。所以用H2SO4/雙氧水為Base 的酸較佳(還含有草酸鈉)。

c.藥液使用消耗分別以H2SO4及Neutralizer用自動控制設備來補充維護。(3)整孔：

除膠渣后孔內呈現雙極現象，其中Cu呈現高電位正電，Glass fiberEpoxy呈負電，整孔使表面清潔，孔壁呈正電性，以利Pd/Sn Colloid負電離子團吸附。

采用陰離子表面活性劑和硫酸。（4）微蝕：

清除清孔后表面之所形成的薄膜和氧化物。微蝕液種類：sps(過硫酸鈉)+硫酸，過硫酸銨+硫酸體系;雙氧水+硫酸體系.微蝕速度40～60u/s.(5)預活化 Catalpretreatment 1.為避免微蝕形成的銅離子帶入Pd/Sn槽，污染槽液。2.降低孔壁的表面張力

預浸槽與活化槽的成分基本相同，區別在于預浸槽中不含活化劑鈀。酸性膠體鈀預浸液成分：SnCl2 ：30g/L、HCl：30ml/L、NaCl：200g/L、脲素：50g/L(6)活化

①活化反應機理：溶液中的Sn2+ 和Pd2+ 的濃度為2：1時所得到的活化液活化性能最好，因此時Sn2+ 和Pd2+ 在溶液中反應形成不穩定的絡合物，Pd 2+ + 2Sn2+ →〔PdSn2〕6+ →Pd+Sn4+ +Sn 2+在30℃時〔PdSn2〕6+ 絡離子歧化反應12min，大約有90%以上的絡合離子被還原成金屬鈀，它 們呈現出極其細小的金屬顆粒分散在溶液中，當加入大量Sn2+ 的和Cl--時，這些細小的鈀核表面上很快吸附大量的Sn2+ 的和Cl-，形成帶負電的膠體化合物 〔Pd（SnCl3）〕-，這些膠體化合物懸浮在溶液中（負 負相斥），不會沉聚，膠體鈀在酸性環境中較穩定，當表面帶正電荷的印制板浸入處理液后，膠體鈀會很快被基材吸附，而完成活化處理。活化處理過的印制板，在水洗時，表面的SnCl2水解形成堿式錫酸鹽沉淀。

②目前市售的膠體鈀活化劑大多為鹽基膠體鈀。PdCl2：1g/l、NaCl：250g/l、SnCl2：12。8g/l、HCl：40ml/l、Na2SnO3：2g/l脲素：50g/l。

③CAT44濃縮液是一種不易燃，酸性，深褐色的液體，每公升大約含鈀4。7g，比重約1。2。

(7)速化 Accelerator

+71.Pd膠體吸附后必須去除Sn使Pd2+曝露如此才能在未來無電解銅中產生催化作用形成化學銅，實質是使堿式錫酸鹽溶解，可用酸也可用堿處理，效果最好的是 1%的HBF4處理1~~2min。

2.基本化學反應為

Pd+2/Sn+2(HF)Pd+2(ad)+ Sn+2(aq)Pd+2(ad)(HCHO)Pd(s)(8)化學鍍銅

鍍液成分及作用：

銅鹽（253A CuSO425H2O）、絡合劑（253E EDTA 絡合銅離子，減緩沉積速率），還原劑（甲醛，次磷酸鹽（新的還原劑，反應機理：Cu2+ ＋ H2PO2－ ＋H2O ====Cu↓+ H2PO3＋2H＋（酸性）；Cu2+ ＋ H2PO2－ ＋2OH－ ====Cu↓+ H2PO3＋H2O（堿性）），PH值調節劑（NaOH，甲醛在強堿條件下才具有還原性，因此必須加入適量的堿。

添加劑：溶液中存在微量的Cu+，其歧化反應形成的銅粉具有催化作用，易加速化學銅溶液的分解。添加劑能絡合Cu+，減小Cu+ 的干擾。

反應機理：

正常反應為 2HCHO+4OH++Cu2+→Cu+2HCOO-+H2O+H2 從反應式可看出，溶液必須為強堿性，HCHO的還原能力取決于堿性強弱，即PH值。在堿性中，必須有足夠的絡合劑，以穩定Cu2+不致生成 沉 淀。溶液中的相應成分必須保持相應的一定比例。同時反應必須有催化劑的催化作用。

副反應： 不管鍍銅液使用與否，總是存在以下兩個反應： Cu2O的生成：2Cu2+ +HCHO+5OH-→Cu2O+HCOO-+3H2O Cu2O +H2O→2Cu+ +2OH-2Cu+ →Cu2+ +Cu 形成的銅 粉是分子量級的，分散于溶液中，這些小顆粒具有催化能力，當銅粉數量較多時，就會引起沸騰式的反應，導致溶液迅速分解。HCHO與NaOH的反應：2HCHO+OH-→HCOO-+CH3OH 對于放置不用的化學銅液，幾天后，因歧化反應，HCHO變成CH3OH和HCOOH，且消耗大量的NaOH，溶液PH值變低，因此放置不用的溶液重新起用時，必須重新調整HCHO和PH值，特別是HCHO含量小于3g/L時，會加速Cu2O的生成，加速銅液的分解。

目前新工藝：超聲波輻射化學鍍銅、激光增強化學鍍、無鈀化學鍍（9）剝掛架

10、一次銅

非導體的孔壁經PTH金屬化后立即進行電鍍銅制程, 其目的是鍍上200~500微英吋以保護僅有20~40微英吋厚的化學銅被后制程破壞而造成孔破(Void)。

三、外層制作

1、銅面前處理（同內層制作工序）

2、壓干膜：（溶劑顯像型、半水溶液顯像型、堿水溶液顯像型），目前流行的為堿水溶液顯像型，以碳酸鈉顯像、用稀氫氧化鈉剝膜。

一、干膜的結構和種類

(1)干膜制造印制電路的優點 分辨率高，能制造線寬0.1mm的圖形，在干膜厚度范圍以內都能獲得邊緣垂直的線條，保證線條精度；干膜的厚度和組成基本穩定，避免成像時的不連續性，可靠性高；便于掌握。應用干膜可大大簡化印制板制造工序，有利于實現機械化和自動化。

(2)干膜結構 干膜由保護膜聚乙烯、光致抗蝕劑膜和載體聚酯薄膜三部分組成，三者厚度分別是25弘m，幾十至100μm和25μm。

(3)干膜種類 依照干膜顯影和去膜方法的不同，將干膜分成三類：溶劑型干膜、水溶性干膜和剝離型干膜。

根據干膜的用途，也將干膜分成三類：抗蝕干膜、掩孔干膜和阻焊干膜。(4)干膜的主要成分及作用

①膠黏劑 主要是使膠膜具有一定的化學、物理及機械性能，通常是酯化或酰胺化的聚苯丁樹脂。膠黏劑不含感光基團，屬于光惰性物質，它與組分的混溶性、成膜性、顯影性和去膜性良好。

②光聚合單體 是膠膜的主要成分，在光引發劑的存在下，經紫外光照射發生聚合反應，而不溶于顯影液，未感光部分被顯影掉，形成抗蝕干膜圖像。光聚合單體還是增塑劑，直接影響干膜的韌性、抗蝕性及貼膜性。它主要采用高沸點、易混溶的多官能團不飽和酯類，如三乙二醇雙丙烯酸酯，季四醇三烯酸酯等。③光引發劑 在紫外光的照射下分解成游離基，引發聚合和交聯反應的物質常用安息醚，叔丁基蒽、醌等。④增塑劑 用于增加干膜的韌性，降低貼膜溫度，常用的是三縮乙二醇二乙酸酯。

⑤增黏劑 可增強干膜與銅表面之間的結合力，克服干膜固化后與銅表面之間產生應力而黏附不牢引起膠膜起皮翹起、滲鍍。常用增黏劑有苯并三氮，苯并咪唑等，是氮雜環化合物，與銅表面形成配價鍵結構而提高黏附力。

⑥熱阻聚劑 在于膜的制造、運輸、貯存和使用過程中，可能發生熱聚合，影響干膜的解像力和顯影性能。為阻止熱能引發的干膜聚合，可在于膜抗蝕劑中加入了對苯二酚，對甲氧基酚等物質。

⑦色料為使干膜抗蝕劑感光顯影后形成良好的視覺反差，在干膜中加入了孔雀石綠、甲基紫、亞甲基藍等顏料。

⑧溶劑 干膜中常用溶劑是丙酮和乙醇。

操作環境：無塵室中進行萬級以上，環境溫度應控制在23°±3，相對濕度應保持50RH±5左右。操作人員也要帶手套及抗靜電之無塵衣帽。

壓膜機可分手動及自動兩種,有收集聚烯類隔層的卷輪、干膜主輪、加熱輪、抽風設備等四主要部份。一般壓膜條件為：

壓膜熱輪溫度 120°±10 板面溫度 50±10 壓膜速度 1.5~2.5米/分 壓力 15-40 psi

3、曝光： 曝光機種類 手動與自動

平行光與非平行光 LDI雷射直接暴光

A.手動曝光機是將將欲曝光板子上下底片以手動定PIN（引線末端的一段，通過軟釬焊使這一段與印制板上的焊盤共同形成焊點）對位后送入機臺面 吸真空后曝光

B.自動曝機一般含Loading/unloading，須于板子外框先做好工具孔，做初步定位。再由機臺上之CCDCheck底片與孔的對位狀況并做微調后入曝光區。

C、非平行光與平行光的差異：平行光可降低Under-Cut 其差異點可見圖8.5顯影后的比較做細線路(4mil以下)非得用平行光之曝光機

D、LDI(Laser Direct Imaging)激光直接感光之設備與感光方式是利用特殊之感光膜coating在板面。不須底片直接利用激光掃描曝光其細線可做 到2mil以內利用多beam方式18in324in的板子已有號稱曝光時間僅30秒。

4、顯影

顯像是把尚未發生聚合反應的區域用顯像液（碳酸鈉）將之沖洗掉已感光部份則因已發生聚合反應而洗不掉仍留在銅面上成為蝕刻或電鍍之阻劑膜注意在 顯像前不可忘記把表面玻璃紙撕掉。

5、二次銅（負片制作）：（1）脫脂（2）水洗（3）微蝕（4）水洗（5）酸浸（6）鍍銅（7）水洗

（8）鍍錫

鍍液成分及作用：

硫酸銅：是供給槽液銅離子的主源。配槽時要用化學級之含水硫酸銅結晶溶解使用。平時作業中，則由陽極磷銅塊解離補充。配液后要做活性炭處理(Carbon treatment)及假鍍(是指對于重金屬污染物，可用較大面積的電解鎳板，經活化洗凈后，進入鍍液中進行電解，以此去除重金屬離子。這種方法叫做“假鍍”（dummy）)

硫酸：要使用試藥級的純酸硫酸有導電及溶解陽極的功用。日常操作中銅量因 吹氣的氧化作用使陽極膜的溶解增加故液中的銅量會漸增而酸量會漸減。要逐日作分析，以維持其酸與銅之重量比在10:1以上，以維持良好的分布力。鍍液在不鍍時要關掉吹氣以防銅量上升酸量下降及光澤之過度消耗。

氯離子：有助陽極的溶解及光澤劑的發揮功能。使陽極溶解均勻，鍍層平滑光澤。氯離子正常時陽極膜呈黑色，過量時則變成灰白色，配液及添加用的水一 定要純，不可用自來水。因其加有氯氣或漂白粉含次氯酸鹽會帶入大量的氯離子

陽極：須使用含磷0.02-0.06的銅塊其面積最好為陰極的兩倍

添加劑：主要有活性劑（聚乙二醇）、光澤（乙撐硫脲,二硫苯駢咪唑,四氫噻唑硫酮）、整平（）、載體、潤濕（消除氫氣泡吸附在鍍層表面所產生的針孔，主要種類包含乙基巳基硫酸鈉、乙基巳基硫酸鈉）等功能。

鍍液的過濾循環：:一則使鍍液流動，再則使浮游物被濾掉。其過濾速度應每小時至少使鍍槽全部鍍液能循環3次。當然速度愈大愈能降低擴散層的厚度，有利電鍍。濾心要在5微吋以下之密度以達清潔之目的。

6、鍍錫：

二次銅后鍍錫鉛合金的目的：

a.蝕刻阻劑, 保護其所覆蓋的銅導體不會在堿性蝕銅時受到攻擊 b.裝配焊接, 須再經IR重熔,目前多已不使用.由于鉛對人體有頗大的為害,廢液處理不便宜因此純錫電鍍已漸取代傳統錫鉛 鍍錫液組成：硫酸亞錫，硫酸和添加劑（蛋白質(Peptone)白明膠(Gelatin)-Naphthol 鄰苯二酚(Hydroquinone)）組成，硫酸亞錫含量控制在35克/升左右，硫酸控制在10%左右。

鍍錫前需要進行水洗和酸洗，以消除Cu2+等離子污染影響。

7、蝕刻：

A.剝膜:將抗電鍍用途的干膜以藥水剝除 B.線路蝕刻:把非導體部分的銅溶蝕掉

堿性環境下，蝕刻液成分見內層銅蝕刻工序。

在堿性環境溶液中銅離子非常容易形成氫氧化銅之沉淀，需加入足夠的氨水，使產生氨銅縫合離子團。則可抑制其沉淀的發生。同時使原有多量的銅及繼續溶解的銅在液中形成非常安定的氨銅絡合離子。此種二價的 氨銅絡合離子又可當成氧化劑使零價的金屬銅被氧化而溶解。不過氧化還 原反應過程中會有一價亞銅離子)出現即：一反應之中間態亞銅離子之溶解度很差必須輔助以，氨水氨離子及空氣中大量的氧使其繼續氧化成為可溶的二價銅離子而又再成為蝕銅的氧化劑周而復始的繼續蝕銅直到銅量太多而減慢為止故一般蝕刻機之抽風除了排除氨臭外更可供給新鮮的空氣以加速蝕銅

8、剝錫(鉛):最后將抗蝕刻的錫(鉛)鍍層除去 上述步驟是由水平聯機設備一次完工

剝錫液成分：溶液組成有氟系/H2O2,HNO3/H2O2等配方。

1、首先將需要處理的工件放入退錫水中，工件要錯開放置,不要重疊,25℃—40℃條件下退除錫鍍層，以退盡為止。

2、當錫鍍層退除后，在銅基體上會有一層灰黑色的膜，視客戶要求而定，如需要去除此膜則必須用我司配送的除膜劑再清洗一次。

3、將退盡錫層的工件從退錫水中取出后，用自來水沖洗干凈，然后投入到除膜劑中把銅基體表面上的膜去掉，大約浸泡20秒鐘至1分鐘。最后取出工件用潔凈自來水沖洗干凈即可。

4、在退錫過程中要輕緩對工件進行攪拌,但要注意:不要使工件與工件之間因碰撞而損害了精密零件.最好是將工件裝在固定的塑料框中,工件與工件之間有一定距離,退鍍過程只要晃動框,而不需要碰到工件.同時也避免了工件之間的重疊.9、防焊：

主要工藝流程如下：

印墨包含印刷型和簾涂型、靜電噴涂型。

預烤：趕走油墨內的溶劑,使油墨部分硬化,不致在進行曝光時黏底片 后烤： A.通常在顯像后墨硬度不足,會先進行UV硬化,增加其硬度以免做檢修時刮傷.B.后烤的目的主要讓油墨之環氧樹脂徹底硬化,文字印刷條件一般為150°C,30min

10、文字印刷

11、表面焊墊的各種處理（1）金手指及噴錫 A金手指：

a.貼膠,割膠：目的是讓板子僅露出欲鍍金手指之部份線路,其它則以膠帶貼住防鍍.b、鍍鎳（垂直）：在此是作為金層與銅層之間的屏障防止銅擴散。鎳液則是鎳含量甚高而鍍層應力極低的氨基磺酸鎳(Ni(NH2SO3)2)或者硫酸鎳，還有輔助劑（硼酸（緩沖作用，維持pH平衡，濃度35~55g/l）、氯化鎳（保證陽極正常溶解，防止陽極鈍化）、光亮劑（ACR-3010，濃度25~35ml/l）、防針孔劑（趕走氫氣泡，陰離子表面活性劑：十二烷基硫酸鈉、二乙基已基硫酸鈉））

c、鍍金：以弱酸性檸檬酸系列的微氰鍍液為宜。B、噴錫（又稱熱風平整）噴錫又稱熱風整平，是將印制板浸入熔融的焊料中，再通過熱風將印制板的表面及金屬化孔內的多余焊料吹掉，從而得一個平滑，均勻光亮的焊料涂覆層。

分為垂直式和水平式。流程：

烤板——前處理——助焊劑涂覆—— 浸入熔融焊料——熱風整平—— 后處理。

前處理包含：脫脂——清洗——微蝕——水洗酸洗(中和)——水洗熱風干

（2）OSP（有機保焊膜,又稱護銅劑,）

潔凈的裸銅表面上，以化學的方法長出一層有機皮膜。這層膜具有防氧化，耐熱沖擊，耐濕性，用以保護銅表面于常態環境中不再繼續生銹（氧化或硫化等）；但在后續的焊接高溫中，此種保護膜又必須很容易被助焊劑所迅速清除，如此方可使露出的干凈銅表面得以在極短的時間內與熔融焊錫立即結合成為牢固的焊點。

除油所使用藥液成分：(1)檸檬酸(2)潤濕劑(非離子界面活性劑)微蝕所用藥液同內層微蝕工序（(1)過硫酸鈉、(2)硫酸），使銅表面微粗化，與OSP膜之間有更好的附著性。

預浸：主成份為異丙醇及添加劑，作用:使銅面外層上一層保護膜,以避免銅離子帶入OSP槽內.OSP：主成份(1)主成分:苯基三連唑和(2)甲酸；作用使銅面外層覆蓋一層有機保焊膜,防止銅面氧化.（3）化學鎳金

A、化學鍍鎳 鍍液: B.一般常用的鎳鹽為氯化鎳(Nickel Chloride)C.一般常用的還原劑有次磷酸鹽類(Hypophosphite)/甲醛(Formaldehyde)/聯氨(Hydrazine)/硼氬化合物(Borohydride)/硼氫化合物(Amine Borane)D.螯合劑以檸檬酸鹽(Citrate)最常見

E.槽液酸堿度需調整控制傳統使用氨水(Amonia)也有配方使用三乙醇氨(Triethanol Amine)除可調整PH及比氨水在高溫下穩定同時具有與檸檬酸鈉結合共為鎳金屬螯合劑使鎳可順利有效地沉積于鍍件上.B、鍍金

分為“置換式鍍金”與“無電金（化學鍍）”。

“浸鍍金”： 鍍層薄且底面鍍滿即停止，Ni+2Au+→Ni2++2Au由于金和鎳的標準電位相差較大，在合適的溶液中會發生金在鎳表面置換沉積出來從反應式我們可以看出，浸金反應要進行必須要有鎳層的存在，但隨著置換出的金層厚度的增加，鎳被完全覆蓋后，浸金后反應就停止了。

常用化學浸金的配方與工藝條件：

氯化銨（150克/升）；檸檬酸氫二銨（100克/升）； 氰化亞金鉀（2克/升）；穩定劑（適量）溫度大于90℃； PH 4.0 化學鍍金：原理是利用還原劑，將金還原后均勻沉積在被鍍物上，達到所需要的厚度，金厚度可達15μ″以上。其反應式：Au++Red→Au0+ox 金（以氰化亞金鉀形式加入）0.5-2克/升 檸檬酸銨 40-60克/升 氯化銨 70-80克/升 偏亞流酸鉀（鈉）10-15克/升 次亞磷酸鈉 10-15克/升 PH 4.5-5.8 溫度 90℃

化學鍍鎳層是極為均勻的，只要鍍液能浸泡得到，溶質交換充分，鍍層就會非常均勻，幾乎可以達到仿形的效果。電鍍無法對一些形狀復雜的工件進行全表面施鍍，但化學鍍過以對任何形狀工件施鍍。

4、化學沉錫(垂直生產線)

酸性除油劑：甲烷磺酸＜10~25% ；丁氧基乙醇＜2.5~10%；水：剩余部份 微蝕液：硫酸氫鈉＜10~25%，過硫酸鈉＜50~100%

浸錫基本劑：LP

浸錫基本劑：2000 外觀：無色

外觀：無色 狀態：液體

狀態：液體 比重：1.33g/l

比重：1.12g/l 溶解性:完全溶于水

溶解性:完全溶于水 氣味:有較強的刺激性

氣味:有刺激性氣味 主要成份:

主要成份: 甲基磺酸＜10~25% 硫脲＜10~25% 水：剩余部份

水：剩余部份 錫溶液：SF-C

浸錫添加劑 ? 外觀：淺黃色

外觀：無色 ? 狀態：液體

狀態：液體 ? 比重：1.50g/l

比重：1.02g/l ? 溶解性:完全溶于水

溶解性:完全溶于水 ? 氣味:有較強的刺激性

氣味:有刺激性氣味 ? 主要成份:

主要成份: ? 甲基磺酸錫＜25~50%

甲基磺酸＜2.5~5% ? 水：剩余部份

水：剩余部份

5、沉銀

2Ag+ + Cu0 ? 2Ag0 + Cu++

主要工藝流程及藥液

? 酸性清潔(175084, 100ml/L, 43oC, 45s)? 水洗

? 微蝕(175085, 120g/l,175086,10g/l,2%的硫酸，2g/l的硫酸銅，37oC, 1min)? 水洗

? 預浸(0.1-0.2N的硝酸, 175098，0.01-0.02M，38oC, 30s)? 銀槽(0.12-0.22N的硝酸, 175098，0.02-0.04M，175097，0.6-0.9g/l, 52oC,60s)熱純水洗

? 抗氧化(XD-7437-T, 175503，30%,49-54oC, 1min)水洗

? 吹烘干

四、后序工序

成型、清洗、檢驗。

清洗：上板、高壓沖洗——輕刷——水洗——吹干——烘干——冷卻